Intel Corp is replacing its chief executive officer after only two years in what had been a rough stretch for the chipmaker.
Bob Swan, who became the company’s CEO in early 2019, is in the middle of next month to be replaced by industry veteran Pat Gelsinger, the company said.
The choice of Gelsinger, who decades ago started his career as an Intel engineer, puts the semiconductor pioneer back in the hands of a tech expert at a time when it is struggling to keep up with market changes and growing competition.
Photo: Reuters
On Wednesday, Intel’s stock jumped 7 percent on news of the change at the top.
The California-based company said that the change in leadership is unrelated to its financial performance last year, but the surprise shake-up followed several weeks of investor activism by hedge fund Third Point LLC, which had pushed for big changes.
Intel late last month acknowledged that it had received a letter from the New York-based fund and was working with it on ideas “regarding enhanced shareholder value.”
Third Point CEO Daniel Loeb on Wednesday wrote on Twitter that “Swan is a class act and did the right thing for all stakeholders stepping aside for Gelsinger.”
Intel spokesman William Moss said that the leadership change “was not driven by Third Point.”
Intel chairman Omar Ishrak said in a prepared statement that “the board concluded that now is the right time to make this leadership change to draw on Pat’s technology and engineering expertise during this critical period of transformation at Intel.”
the chipmaker last year disclosed that there would be a substantial delay in its development of a next-generation process already in use by other major suppliers, including Taiwan Semiconductor Manufacturing Co (台積電).
The unexpected snag meant that Intel’s 7-nanometer processing technology is unlikely to be ready until the end of next year or early 2023, potentially putting the company behind its rivals.
Apple Inc last year also dealt a blow to Intel when it began replacing Intel processors with Apple-designed chips in its new computers.
Intel faced yet another challenge when US graphics chipmaker Nvidia Corp announced plans to buy UK-based Arm Ltd in a deal that would create a global powerhouse in the industry.
Gelsinger has since 2012 been CEO of software company VMware Inc and has more than four decades of experience in the industry. He spent most of that time with Intel, where he began his career and was its first chief technology officer.
Swan, a former chief financial officer at Intel, assumed interim leadership in 2018. His finance background, including top finance roles at eBay Inc and several other firms, marked a shift for Intel, which has mostly had engineers at the top since its 1968 founding, although its fifth CEO was an economist.
Swan said in a prepared statement that it is the right time for a transition and that he fully supports Gelsinger’s arrival.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome
RSS