Intel Corp has talked with Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) and Samsung Electronics Co about the Asian companies making some of its best chips, but the Silicon Valley pioneer is still holding out hope for last-minute improvements in its own production capabilities.
After successive delays in its chip fabrication processes, Santa Clara, California-based Intel has yet to make a decision less than two weeks ahead of a scheduled announcement of its plans, people familiar with the deliberations said.
Any components that Intel might source from Taiwan would not come to market until 2023 at the earliest and would be based on established manufacturing processes already in use by other TSMC customers, said the people, asking not to be identified because the plans are private.
Photo: Ashley Pon, Bloomberg
Talks with Samsung, whose foundry capabilities trail TSMC’s, are at a more preliminary stage, the people said.
TSMC and Samsung representatives declined to comment, while an Intel spokesperson referred to previous comments by CEO Bob Swan, who has promised investors he would set out his plans for outsourcing and putting Intel’s production technology back on track when the company reports earnings on Thursday next week.
TSMC, the largest maker of semiconductors for other companies, is preparing to offer Intel chips manufactured using a 4-nanometer process, with initial testing using an older 5-nanometer process, the people said.
The company has said it would make test production of 4-nanometer chips available in the fourth quarter of this year and volume shipments the following year.
TSMC expects to have a new facility in Hsinchu County’s Baoshan Township (寶山) operational by the end of this year, which can be converted to production for Intel if required, one of the people said.
TSMC executives previously said the Baoshan unit would house a research center with 8,000 engineers.
Intel’s strategic shifts are happening at a time of booming demand, as well as technological change in the chip industry.
The traditional method of improving performance by shrinking and cramming more transistors into each package is being supplanted by more sophisticated techniques that include stacking processor and memory components into single chips and the introduction of more tailored designs for tasks like artificial intelligence.
Separately, United Microelectronics Corp (UMC, 聯電) on Saturday had power-supply disruptions at two plants in Hsinchu that temporarily affected production, UMC chief financial officer Liu Chi-tung (劉啟東) said.
“The company will discuss with customers, and try its best to make up for lost production,” Liu said by telephone. “No major financial impact is expected.”
The overall impact of the incident was “quite minor,” Liu said.
Power was being gradually restored, he said.
From India to China to the US, automakers cannot make vehicles — not that no one wants any, but because a more than US$450 billion industry for semiconductors got blindsided. How did both sides end up here? Over the past two weeks, automakers across the world have bemoaned the shortage of chips. Germany’s Audi, owned by Volkswagen AG, would delay making some of its high-end vehicles because of what chief executive officer Markus Duesmann called a “massive” shortfall in an interview with the Financial Times. The firm has furloughed more than 10,000 workers and reined in production. That is a further blow
MOBILE SMART: The Dimensity 1200 is 22 percent better in terms of performance than its predecessor, and 25 percent more power-efficient, the handset chip designer said MediaTek Inc (聯發科) yesterday unveiled its premium 5G processors — the Dimensity 1200 and Dimensity 1100 — as it vies for a larger slice of the world’s rapidly growing 5G smartphone market. Manufactured using Taiwan Semiconductor Manufacturing Co’s (台積電) 6-nanometer process technology, the Dimensity 1200 processor performs 22 percent better than the previous generation Dimensity 1000+ processor, and is 25 percent more power-efficient, MediaTek said. Chinese smartphone brands Xiaomi Corp (小米) and Realme Mobile Telecommunications (Shenzhen) Co (銳爾覓移動通信) are to be the first adopters of the latest Dimensity chips, the companies said during a virtual media briefing. Xiaomi plans to equip its first
Answering to a reported request by Germany to help address a chip shortage in its auto industry, the Ministry of Economic Affairs (MOEA) yesterday said that it was in talks with domestic chip suppliers. Foreign media over the weekend reported that German Minister of Economic Affairs Peter Altmaier had sent a request to Taipei to ask Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) to cooperate more closely with German automakers to provide microchips and sensors, to bridge a shortage that has emerged over the past few months. The MOEA said that it had not yet received the request and could therefore not elaborate
FOCUS ON FOUNDRIES: An analyst said that some investors would be disappointed because they were expecting a larger announcement of a partnership with TSMC Intel Corp’s incoming chief executive officer Pat Gelsinger on Thursday pledged to regain the company’s lead in chip manufacturing, countering growing calls from some investors to shed that part of its business. “I am confident that the majority of our 2023 products will be manufactured internally,” Gelsinger said. “At the same time, given the breadth of our portfolio, it’s likely that we will expand our use of external foundries for certain technologies and products.” He plans to provide more details after officially taking over the CEO role on Feb. 15, but Gelsinger was clear that Intel is sticking with its once mighty