The global semiconductor industry is to experience a second straight year of contraction in production value this year as the COVID-19 pandemic dampens demand for chips used in mobile phones and automotive devices, TrendForce Corp (集邦科技) said yesterday.
Demand from remote working and online learning, which boosted PC and server sales in the first half of the year, is also likely to ebb in the second half, leading to an opaque outlook for business prospects, the Taipei-based research house said in a report.
Inventory issues might also return in the third quarter, while seasonal demand in the fourth quarter is uncertain, as it largely depends on whether commercial activities will return to normal soon, the report said.
Overall, increases in supply chain inventory might lead to milder revenue growth for the semiconductor industry in the second half, compared with the first half, it said.
This year as a whole, the global semiconductor industry is expected to see its production value fall 1.3 percent annually to US$301.9 billion, excluding the memory chip segment, TrendForce said.
That was a downward revision from its pre-pandemic forecast in December last year of a 3.8 percent annual expansion to US$317.5 billion.
“Due to the impact of the pandemic, consumer electronics, [and] automotive and communications segments are at a higher likelihood of reporting contraction, while computing [and] industrial devices are to have better growth opportunities,” TrendForce said.
Specifically, demand for chips used in servers, commercial notebook computers and Chromebooks are on the rise, but demand for chips for smartphones, consumer electronics and automotive components are slumping, it said.
As smartphone chips and chips used in automotive electronics account for more than 50 percent of the semiconductor industry’s overall production value, their decline drags down the overall chip industry, it said.
TrendForce said it is conservative about the market outlook for the second half of the year.
Integrated device manufacturers (IDM) suffered a drastic decline in production and shipments in the first two quarters due to pandemic-induced factory shutdowns and logistics disruptions, the researcher said.
Poor demand for vehicles added to the slump, it said.
TrendForce said it has a more upbeat outlook about fabless companies and foundries, which are to outperform IDMs, because production at foundries has been spared by the pandemic, as their factories are in places that have been less affected by the virus, the researcher said.
Fabless companies have greater flexibility in adjusting chip specifications to cope with changes in consumer demand, which helps them better weather the crisis, it said.
Fabless companies and IDMs are major clients of foundries.
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
People walk past advertising for a Syensqo chip at the Semicon Taiwan exhibition in Taipei yesterday.
NO BREAKTHROUGH? More substantial ‘deliverables,’ such as tariff reductions, would likely be saved for a meeting between Trump and Xi later this year, a trade expert said China launched two probes targeting the US semiconductor sector on Saturday ahead of talks between the two nations in Spain this week on trade, national security and the ownership of social media platform TikTok. China’s Ministry of Commerce announced an anti-dumping investigation into certain analog integrated circuits (ICs) imported from the US. The investigation is to target some commodity interface ICs and gate driver ICs, which are commonly made by US companies such as Texas Instruments Inc and ON Semiconductor Corp. The ministry also announced an anti-discrimination probe into US measures against China’s chip sector. US measures such as export curbs and tariffs