Taiwan Ratings Corp (中華信評) has downgraded the credit outlook for Taipei Financial Center Corp (台北金融大樓) from “stable” to “negative,” as the operator of the Taipei 101 skyscraper has seen a slump in tourists and shoppers.
The local arm of S&P Global Ratings said the negative outlook reflects the likely deterioration in the company’s credit profile this year and uncertainty over a recovery.
A dire lack of foreign tourists would diminish revenue from its observatory and tourist spending at its shopping mall, the agency said.
Photo: Liao Chen-huei, Taipei Times
The number of foreign visitors dropped close to zero over the past few weeks due to border controls and flight bans to curb the spread of COVID-19.
“We expect international travel to remain muted for six more months, as the number of infections is still on the rise worldwide,” Taiwan Ratings said, expecting a modest recovery toward the end of the year.
That might affect the number of visitors to the observatory and the observation deck’s revenue this year by up to 80 percent, it said.
Local customers have also reduced shopping frequency to avoid infections, it added.
Retail sales at the Taipei 101 shopping center are forecast to drop by 31 to 35 percent given the store’s collection of luxury and fashion brands for which consumption is discretionary in nature, it said.
The office building’s rental income would not be affected by the pandemic, because rental rates are fixed and long-term in nature, it said.
In addition, the Taipei 101 building has built up a strong tenant portfolio, mostly high-profile global firms and large domestic companies that can afford above-average rents, it said.
However, office rent accounts for only 26 percent of overall operating income and would not be sufficient to compensate for the slowdown in other segments, it said.
This story has been modified since it was first published to avoid any inconvenience caused to Taipei Financial Center Corp.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass