Citigroup Inc yesterday announced the appointment of Peter Babej as its new chief executive officer for the Asia-Pacific region.
Babej will be responsible for all businesses in the 17 countries and jurisdictions where Citi is present.
Before his current role, Babej served as global head of the Financial Institutions Group. Under his leadership, Citi attained a leading position in the sector and participated in numerous landmark transactions globally.
Photo courtesy of Citibank Taiwan Ltd
Over the past decade, Citi has won increasing recognition as the leading global bank for financial institutions. Under Babej’s leadership, the group has participated in some of the most significant transactions in the sector, including several Asia-driven mergers and acquisitions.
Bebej will draw on his deep knowledge of the financial services landscape in Asia, where Citi continues to see great opportunities, including fast-growing digital adoption, for which it is well-positioned given its footprint and capabilities.
Prior to joining Citi, Babej held senior roles at Deutsche Bank AG and Lazard Ltd, where he advised financial institutions across North America, Europe and Asia.
Babej will begin transitioning to this new role immediately.
Citi has performed strongly in the Asia-Pacific region. The company released its third-quarter results on Tuesday, which showed that revenue grew 7 percent year-on-year to US$4.01 billion and net income rose 10 percent to US$1.27 billion during the same period.
Asia Pacific is Citi’s second-largest region outside North America and contributes about one-fifth of revenue and close to a third of net income.
LIMITED IMPACT: Investor confidence was likely sustained by its relatively small exposure to the Chinese market, as only less advanced chips are made in Nanjing Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) saw its stock price close steady yesterday in a sign that the loss of the validated end user (VEU) status for its Nanjing, China, fab should have a mild impact on the world’s biggest contract chipmaker financially and technologically. Media reports about the waiver loss sent TSMC down 1.29 percent during the early trading session yesterday, but the stock soon regained strength and ended at NT$1,160, unchanged from Tuesday. Investors’ confidence in TSMC was likely built on its relatively small exposure to the Chinese market, as Chinese customers contributed about 9 percent to TSMC’s revenue last
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
Hon Hai Precision Industry Co (鴻海精密), which assembles servers for Nvidia Corp, yesterday said that revenue last month rose 10.61 percent year-on-year, driven by strong growth in cloud and networking products amid continued front-loading orders for artificial intelligence (AI) server racks. Consolidated revenue expanded to NT$606.51 billion (US$19.81 billion) last month from NT$548.31 billion a year earlier, marking the highest ever in August, the company said in a statement. On a monthly basis, revenue was down 1.2 percent from NT$613.86 billion. Hon Hai, which is also a major iPhone assembler, added that its electronic components division saw significant revenue growth last month, boosted