Microsoft Corp is showcasing four new operating systems (OS) at Computex in Taipei tomorrow that it says will cater to all facets of an end-user’s computing life.
The Redmond, Washington-based company has been working on the four operating systems — Windows 7, Windows Embedded, Windows Mobile and Windows Server — to regain consumer and corporate confidence following its unsuccessful launch of Vista OS in 2005.
Windows 7 RC (the trial version currently available called release candidate) has won wide acclaim. The software giant’s introduction of Touch Pack for Windows 7, a set of games and applications optimized for multi-touch computing, has generated interest from the touch-screen liquid-crystal-display (LCD) panel makers and LCD component suppliers.
At this year’s Computex, Microsoft will collaborate with 16 personal computer manufacturers on more than 30 products running on the new operating system, the Taipei Times’ sister newspaper, the Liberty Times, reported yesterday.
The report said the Windows 7 products on display would include notebooks, tablet PCs, all-in-one PCs and netbooks.
PC makers in collaboration with Microsoft include Acer Inc (宏碁), Asustek Computer Inc (華碩), Gigabyte Technology Corp (技嘉), BenQ Corp (明基), Dell Inc, Hewlett-Packard Co, Lenovo Group Ltd (聯想), MiTAC International Corp (神達), Micro-Star International Co (微星), Sharp Corp and Toshiba Corp, the paper said.
Global PC shipments are likely to surpass 322 million units by 2011 from 282 million units this year, the International Data Corp (IDC) forecast early last month, with shipments of notebooks increasing from this year’s 54 percent of the total PC market to 61 percent by 2011.
Microsoft and global PC makers hope the Windows 7 release will spur a wave of hardware upgrades, creating business opportunities for all parties involved.
However, Gartner Inc predicts a complete phase out of corporate XP by the end of 2012 at the latest, as various information technology companies are contemplating technology migration during the economic downturn. They will be forced to do so when their XP versions no longer receive XP upgrades or customer support.
To rally consumer support for its new operating system, Steven Guggenheimer, a Microsoft vice president in charge of the global original equipment manufacturing (OEM) division, and Eddie Wu (吳勝雄), general manager for Microsoft’s OEM division in Asia, will jointly deliver keynote speeches at the Nangang Exhibition Hall tomorrow.
Kevin Dallas, general manager of Microsoft Windows embedded business, will address the company’s four operating systems on Wednesday at the Taipei International Conference Center.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would