If Taiwan signed an economic cooperation framework agreement (ECFA) with China that would help it expand into other Asian markets, it could boost the domestic economy by as much as 3.31 percent, an academic told a gathering of business groups yesterday.
Citing estimates by the Chung-Hua Institution for Economic Research (CIER, 中經院), Steve Lin (林祖嘉), professor of economics at National Chengchi University, said if inking a trade agreement with China allowed Taiwan to make inroads into other Asian markets, GDP would likely grow by 3.31 percent.
The Taiwan Institute of Economic Research (TIER, 台經院), however, forecast the boost at 0.05 percent.
But if Taiwan missed the opportunity to expand its presence in regional markets, the economy would contract by as much as 1.8 percent because of the formation of ASEAN Plus Six (China, Japan, South Korea, India, Australia and New Zealand), he said, citing CIER forecasts.
The nation’s plastics and chemicals sector would be hardest hit, he said, losing out on up to US$1.74 billion in business opportunities in the ASEAN Plus Six markets because Taiwanese companies would be marginalized.
Although signing an ECFA with China would in the beginning increase Taiwan’s dependence on the Chinese market, in the long-run it would help expand Taiwan’s presence in other Asian markets.
To address the opposition’s concerns over the trade pact, Lin suggested the government consider including an exit clause in the ECFA as a defense mechanism against malicious acts by China such as dumping cheap, poor-quality products.
Rock Hsu (許勝雄), who chairs Kinpo Group (金仁寶集團), one of the country’s biggest electronics groups, yesterday also threw his support behind the proposed ECFA.
Hsu said that any boost to the nation’s GDP, whether minimal or significant, would make the ECFA worth it.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would