Taiwan-based banks posted an average overdue loan rate of 4.33 percent for December last year, a level better than the target set by the Ministry of Finance, according to a quarterly report issued on Friday by Taiwan's Central Bank of China (CBC).
The top five domestic banks with the lowest overdue loan rates are Cathay United Bank (0.82 percent), East Sun Bank (1.18 percent), First Commercial Bank (1.46 percent), Taishin International Bank (1.59 percent) and Chinatrust Commercial Bank (1.65 percent), the CBC report shows.
On the other side, 12 banks, such as Chung Shing Bank and Medium Business Bank of Kaohsiung District, still failed to surpass the government-set level, the CBC report shows. Chung Shing Bank recorded the highest level of 59.03 percent, followed by Medium Business Bank of Hualien District with 23.99 percent, Pan Asia Bank with 22.63 percent and ChinFon Commercial Bank with 19.21 percent.
Among them, seven major public banks posted a lowered average overdue loan of 4.31 percent for February this year, an improvement as compared to January's average level of 4.35 percent, December's 4.37 percent and November's 4.76 percent.
The drop is an indication that the seven major domestic banks -- Bank of Taiwan, Land Bank of Taiwan, Taiwan Cooperative Bank, Chang Hwa Bank, Hua Nan Bank, First Commercial Bank and Medium Business Bank of Taiwan -- have improved their business in writing off bad loans.
LIMITED IMPACT: Investor confidence was likely sustained by its relatively small exposure to the Chinese market, as only less advanced chips are made in Nanjing Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) saw its stock price close steady yesterday in a sign that the loss of the validated end user (VEU) status for its Nanjing, China, fab should have a mild impact on the world’s biggest contract chipmaker financially and technologically. Media reports about the waiver loss sent TSMC down 1.29 percent during the early trading session yesterday, but the stock soon regained strength and ended at NT$1,160, unchanged from Tuesday. Investors’ confidence in TSMC was likely built on its relatively small exposure to the Chinese market, as Chinese customers contributed about 9 percent to TSMC’s revenue last
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
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