GlobalWafers Inc (環球晶圓), the world’s No. 3 silicon wafer supplier, yesterday reiterated its positive outlook on business until 2025, as customers continue to show a strong interest in securing wafer supply by signing long-term supply agreements (LTAs).
The Hsinchu-based company saw prepayments from LTAs swell to a record NT$33.11 billion (US$1.12 billion), up 15 percent from the end of last year, undeterred by growing uncertainty about macro environmental risks including impact from COVID-19 lockdowns, the Russia-Ukraine war, rising interest rates, and higher energy and freight costs.
“We continue to sign LTA contracts, especially for larger diameter wafers and advanced products, with 300-millimeter wafers being our customers’ primary target,” GlobalWafers chairperson Doris Hsu (徐秀蘭) told investors at a teleconference.
Photo: Fang Wei-jie, Taipei Times
“We have yet to see a cooling-off in demand from our customers,” Hsu said.
“There is some unevenness in the end market, with demand from the smartphone and notebook markets, for example, slowing slightly, while demand from the automotive, industrial and server markets continue to be very hot,” she added.
“So far, there has been no order cancelation or pushout from our customers,” she added.
Demand is strongest for all types of 300-millimeter wafers, followed by wafers made of compound semiconductor materials, mainly silicon carbide and gallium nitride, GlobalWafers said.
To satisfy the robust demand, the company said it was maintaining its NT$100 billion capacity expansion plan, which includes brownfield and greenfield projects at six sites in Taiwan, the US, Italy, South Korea, Japan and Denmark.
Much longer lead times in equipment delivery could create a bottleneck, and that could lead to a delay of one to two quarters in the construction of new production lines, Hsu said.
All production lines are running at full capacity, she said.
In the first quarter, GlobalWafers’ net profit plunged 35 percent year-on-year to NT$1.75 billion, dragged by a loss of more than NT$6 billion from a drop in 13.67 percent-held Siltronic AG’s market value and foreign exchange rate fluctuations.
That translated into earnings per share of NT$4.01, down from NT$6.18 a year earlier.
Excluding the unrealized losses from Siltronic, GlobalWafers would have seen a record profit of NT$14.16 per share last quarter, the company said.
Operating profit surged 49 percent to NT$5.89 billion, and gross margin improved to a record 42.6 percent, from 35.1 percent a year ago.
GlobalWafers said it is hard to predict whether its gross margin would be able to rise to the levels — 46 or 48 percent — posted by foundry companies or integrated device manufacturers, given the uncertainty arising from the impending imposition of a carbon emissions tax and higher energy costs.
Wafer manufacturing is a power-intensive industry, the company said.
The domestic unit of the Chinese-owned, Dutch-headquartered chipmaker Nexperia BV will soon be able to produce semiconductors locally within China, according to two company sources. Nexperia is at the center of a global tug-of-war over critical semiconductor technology, with a Dutch court in February ordering a probe into alleged mismanagement at the company. The geopolitical tussle has disrupted supply chains, with some carmakers reportedly forced to cut production due to chip shortages. Local production would allow Nexperia’s domestic arm, Nexperia Semiconductors (China) Ltd (安世半導體中國), to bypass restrictions in place since October on the supply of silicon wafers — etched with tiny components to
Singapore-based ride-hailing and delivery giant Grab Holdings Ltd has applied for regulatory approval to acquire the Taiwan operations of Germany-based Delivery Hero SE's Foodpanda in a deal valued at about US$600 million. Grab submitted the filing to the Fair Trade Commission on Friday last week, with the transaction subject to regulatory review and approval, the company said in a statement yesterday. Its independent governance structure would help foster a healthy and competitive market in Taiwan if the deal is approved, Grab said. Grab, which is listed on the NASDAQ, said in the filing that US-based Uber Technologies Inc holds about 13 percent of
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday received government approval to deploy its advanced 3-nanometer (3nm) process at its second fab currently under construction in Japan, the Ministry of Economic Affairs said in a news release. The ministry green-lit the plan for the facility in Kumamoto, which is scheduled to start installing equipment and come online in 2028 with a monthly production capacity of 15,000 12-inch wafers, the ministry said. The Department of Investment Review in June 2024 authorized a US$5.26 billion investment for the facility, slated to manufacture 6- to 12nm chips, significantly less advanced than 3nm process. At a meeting with
Taiwan’s food delivery market could undergo a major shift if Singapore-based Grab Holdings Ltd completes its planned acquisition of Delivery Hero SE’s Foodpanda business in Taiwan, industry experts said. Grab on Monday last week announced it would acquire Foodpanda’s Taiwan operations for US$600 million. The deal is expected to be finalized in the second half of this year, with Grab aiming to complete user migration to its platform by the first half of next year. A duopoly between Uber Eats and Foodpanda dominates Taiwan’s delivery market, a structure that has remained intact since the Fair Trade Commission (FTC) blocked Uber Technologies Inc’s
RSS