Uber Technologies Inc on Thursday filed documents for its much-anticipated public share offering expected to be the largest in the tech sector in years, and a bellwether for other venture-backed start-ups eyeing a US listing.
The filing with the US Securities and Exchange Commission (SEC) contained no specific pricing or timing for the market debut for Uber, which media reports said was expected to raise about US$10 billion.
Uber’s valuation in its latest private investment round was more than US$70 billion, but reports said the ride-hailing giant was likely to seek a market value of close to US$100 billion.
Photo: Reuters
The filing said that Uber offers ride-sharing in about 700 cities, but has bolder ambitions to reshape how people and goods are transported with operations such as meal deliveries, freight, and electric bikes and scooters.
“Our mission is to ignite opportunity by setting the world in motion,” the document filed with the SEC said.
“We revolutionized personal mobility with ridesharing, and we are leveraging our platform to redefine the massive meal delivery and logistics industries. While we have had unparalleled growth at scale, we are just getting started,” it said.
Uber said it operates on six continents with about 14 million trips per day and has totaled more than 10 billion rides since it was founded in 2010.
The filing contained a “placeholder” amount of US$1 billion to be raised, but that figure is expected to increase ahead of the initial public offering (IPO) expected for next month.
The move comes after a lackluster market debut for Uber’s US rival Lyft Inc, which has lost more than 10 percent of its value since its IPO last month.
Chief executive Dara Khosrowshahi, who took over in 2017 as part of an effort to reform a corporate culture marred by misconduct and other scandals, said that Uber has taken steps to restore its brand and credibility.
“Taking this step means that we have even greater responsibilities — to our shareholders, our customers and our colleagues,” Khosrowshahi said in a letter announcing the IPO.
Both Uber and Lyft are predicting that ride-hailing would gain even more traction with autonomous vehicles, allowing more people to give up private vehicles and freeing up more urban space.
“We believe that autonomous vehicle technologies will enable a product that competes with the cost of personal vehicle ownership and usage, and represents the future of transportation,” Uber’s filing said.
However, analysts have warned that Uber and Lyft face a difficult road to profitability amid challenges from regulators and established taxi operators around the world.
Some question the business model of using independent contractors as drivers — a system which the companies say is more flexible and leads to entrepreneurial spirit.
Uber’s revenue grew 42 percent last year to US$11.2 billion, but it continued to lose money from its operations. A net profit was reported for the year from a large asset sale, but operational losses were more than US$3 billion.
“Investors should be ready for a lot of volatility” in Uber, said Scott Rostan, a former investment banker who is currently an adjunct professor at the University of North Carolina.
“In my opinion if you are buying into Uber or Lyft you’re buying into a belief this is going to revolutionize transportation in the future, but a good business doesn’t necessarily mean a good investment,” he said.
Rostan added that both firms would be seeking to step up growth and that “if it turns into a market share fight between Uber and Lyft, profitability is going to be tough.”
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome