The Industrial Technology Research Institute (ITRI, 工研院) yesterday said it is collaborating with local manufacturers to offer new-generation, affordable robots for electronics and logistics companies to automate their factories and warehouses.
Different from the chunky industrial robots that are usually deployed at large-scale factories, the institute said it is more interested in developing collaborative robots for smaller and more diverse factory and depot automation.
“Traditional industrial robots are suitable for large-scale production lines. They need a lot of space and cost a lot of money, which small and medium-sized enterprises cannot afford,” Patrick Yu (游鴻修), acting division director of ITRI’s mechanical and mechatronics systems research labs, told reporters on the sidelines of the Taiwan Automation Intelligence and Robot Show at the Taipei Nangang Exhibition Center, Hall 1.
Photo: CNA
“We believe that collaborative robots, which are designed to work in relative safety with people on the same factory floor, can have richer features and be applied to more industries.”
Such machines could be used to pick up and package goods in an e-commerce depot or in the food processing sector, Yu said.
The Hsinchu-based institute is developing a prototype collaborative robot, Yu said.
The institute has spun off a research unit to put the machines on the market, he said.
The institute in collaboration with Shihlin Electric & Engineering Corp (士林電機) has also developed servomotors for “smart” robotic arms, Yu said.
The institute is also working with Autotek Corp (和樁) to develop an all-in-one machine arm joint, he said.
The institute said its robots would be deployed in smaller factories at affordable prices without major overhauls of workspaces or warehouses.
Their operations would become like Amazon.com Inc’s “smart” warehouses, it said.
Also eyeing growing demand for factory automation, Rong Shin Automation Technology (榮興自動化科技) has partnered with the institute to roll out small, automated conveyor systems for use in the assembly lines and to offer assistance in grocery warehouses.
With a modular design that can be arranged according to where it is to be used, the conveyor systems can transport goods between shelves faster than people, the institute said.
What makes Rong Shin different is that the company also offers leasing services for its products, the institute said.
Noveltek Industrial Manufacturing Inc (恆智重機), which concentrates on goods transportation, also displayed its latest driverless forklifts at the show.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome