Alphabet Inc’s Google yesterday unveiled tools to make augmented-reality (AR) apps for mobile devices using the Android operating system, setting up its latest showdown with Apple Inc’s iPhone over next-generation smartphone features.
Handset-based AR, in which digital objects are superimposed onto the real world on screen, got a huge boost from the popularity of the Pokemon Go game.
Analysts expect the game to make US$3 billion for Apple over two years as gamers buy “PokeCoins” from its app store.
Google’s take on the technology is to first be available on the Samsung Galaxy S8 and Google’s own Pixel handset.
The company said in a blog post that it hoped to make the system, called ARCore, available to at least 100 million users, but did not set a date for a broad release.
Apple in June announced a similar system called ARKit that it plans to release this fall on “hundreds of millions” of devices.
Google and Apple will jockey for the attention of customers and software developers who are to build the games, walking guides and other applications that would make AR a compelling feature.
Many tech industry leaders envision a future in which eyeglasses, car windshields and other surfaces can overlay digital information on the real world.
Google and Microsoft Corp have already experimented with AR glasses.
“AR is big and profound,” Apple CEO Tim Cook told investors earlier this month. “And this is one of those huge things that we’ll look back at and marvel on the start of it.”
Apple and Google have had to make compromises to bring the technology to market.
In Apple’s case, the Cupertino, California-based company decided to make its AR system work with devices capable of running iOS 11, its next-generation operating system due out this fall.
This means it would work on its handsets going back to the iPhone 6s, which have a single camera at the back and standard motion sensors, rather than a dual camera system found on newer models such as the iPhone 7 Plus or special depth-sensing chips in competing phones. That limits the range of images that can be displayed.
Google initially aimed to solve this problem with an AR system called Tango that uses a special depth-sensor, but only two smartphone makers so far support it. With ARCore, Google changed course to work on handsets without depth sensors.
However, the fragmentation of the Android ecosystem presents challenges. To spread its AR system beyond the Galaxy S8 and Pixel handsets, Google would have to figure out how account for the wide variety of Android smartphone cameras or require handsetmakers to use specific parts.
However, Apple is able to make its system work well because it knows exactly which hardware and software are on the iPhone and calibrates them tightly.
Michael Valdsgaard, a developer with the furniture chain IKEA, called the system “rock solid,” adding that it could estimate the size of virtual furniture placed in a room with 98 percent accuracy, despite lacking special sensors.
“This is a classic example of where Apple’s ownership of the whole widget including both hardware and software is a huge advantage over device vendors dependent on Android and the broader value chain of component vendors,” Jackdaw Research founder and chief analyst Jan Dawson said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome