FINANCE
US should lead: Zoellick
The head of the World Bank said yesterday it was right for the US to take a leading role in some global institutions and that the right US candidate for the post of the bank’s next president would be good for the US and the bank. In an interview in Singapore, World Bank President Robert Zoellick also said he did not believe Spain, Italy or Portugal needed bailouts to ease massive debt burdens, but that reforms needed the critical support of Germany and other leading European nations. The World Bank last week launched the nomination process to select a new president to succeed Zoellick when he steps down in June, inviting names from any of its 187 member countries. Some nations say it is time for a non-US candidate to take the helm of the bank, pointing to the growing economic clout of the developing world.
INTERNET
Google sells Clearwire stake
Google Inc on Friday said it would sell its stake in Clearwire Corp, the struggling operator of a wireless data network. The search company is taking a 94 percent loss on the originally US$500 million investment made in 2008. Google said in a regulatory filing that it was seeking to sell its stake starting tomorrow for US$1.60 per share, or US$47 million total. Clearwire shares fell US$0.16, or 6.8 percent, to close on Friday at US$2.11. Google was part of a consortium that included cable companies and equipment provider Intel Corp that injected US$3.2 billion into Clearwire when it merged with a Sprint Nextel Corp unit in 2008. The hope was that Clearwire would be a powerful competitor to the established cellphone companies, providing fast wireless data at low prices.
UNITED STATES
Officials oppose QE3
Two US Federal Reserve officials opposed additional mortgage-bond purchases by the Fed, saying the measure was not needed and that the US central bank should not interfere in credit markets. Federal Reserve Bank of St Louis President James Bullard said he did not favor additional debt buying as inflation risks are “to the upside” and a damaged housing market limits the effectiveness of monetary policy. Federal Reserve Bank of Philadelphia President Charles Plosser said targeting a specific industry such as housing should be left to the US Treasury. “I am worried that if you try to push so hard on monetary policy even when the mechanism isn’t really working, the whole thing blows up on you,” said Bullard, who does not vote on the Federal Open Market Committee (FOMC) this year. He also said that the FOMC would need to mark down its economic forecasts to warrant another program of large-scale asset purchases, known as quantitative easing.
SPORTING GOODS
Nike selling Lin shoes
Nike Inc will start selling Jeremy Lin (林書豪)-themed shoes this weekend, cashing in on the New York Knicks point guard’s recent rise to worldwide fame. Priced at US$130, the shoes will be available on Nike’s Web site. Nike said it would launch the Nike Zoom Hyperfuse Low basketball shoes, made especially for Lin, this weekend in Orlando, Florida, where the NBA is holding its All-Star festivities. “It’s not a signature line, but a version of the shoe that he’s been wearing this season,” the company said. The world’s biggest sporting goods company, headquartered in Beaverton, Oregon, signed Lin in 2010, and launched its “Linsanity” line of clothes at Foot Locker Inc stores last week.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
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