Taiwan FamilyMart Co (全家便利商店), one of the nation’s largest convenience store operators, said yesterday it had decided to continue to expand, using no less than NT$1.5 billion (US$49.3 million) in capital expenditure for next year.
This year, FamilyMart assigned about NT$1.5 billion in capital expenditure to boost its total number of outlets by about 300 to 2,800 by the end of the year.
FamilyMart chairman Pan Chin-ting (潘進丁) said the local economy had been affected by the escalating debt crisis in Europe.
However, Pan added that his company was not deterred at all by the current sluggishness in economic fundamentals and was determined to continue to expand next year.
Pan said he believed convenience store sales would continue to grow, because the business has become a pillar of the local retail sector with consumption remaining consistent.
He added that future investment would focus on establishing a logistics center that is scheduled for inauguration in the first half of next year, while the company would continue to add new outlets all over the nation.
According to FamilyMart, the company will open more large stores, each with an area of between 30 ping (99m2) and 35 ping, to provide venues in which people can socialize, and the outlets will provide more fresh food.
Currently, the convenience store chain operates more than 500 of the larger outlets across the country.
The company is finalizing its expansion plan for next year and deciding how many new stores will be added, it said.
Meanwhile, Pan said the FamilyMart chain in Taiwan would transform itself into a health food supplier and put more emphasis on environmental protection.
Pan said his company would continue to promote roasted sweet potato, which has become popular among local consumers and is expected to generate NT$200 million in sales for FamilyMart this year.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome
RSS