VIA Technologies Inc (威盛電子) has filed suit against Apple Inc for allegedly infringing three US patents for microprocessors used in mobile phones and tablet computers.
VIA, a semiconductor designer based in Taipei, seeks a jury trial and an order to prohibit Apple, the world’s biggest technology company by value, from selling products containing the inventions in the US, according to a complaint filed on Thursday in a federal court in Wilmington, Delaware.
“The products at issue generally concern microprocessors included in a variety of electronic products, such as certain smartphones, tablet computers, portable media players and other computing devices,” VIA said in the complaint.
Apple will dominate Christmas sales of tablet computers as rival products based on Google Inc’s Android system are not competitive enough, researcher Gartner Inc said.
“Apple delivers a superior and unified user experience across its hardware, software and services,” Gartner research vice president Carolina Milanesi said in an e-mailed note on Thursday. “Unless competitors can respond with a similar approach, challenges to Apple’s position will be minimal.”
Worldwide media tablet sales are expected to more than triple this year and reach 63.6 million units, with Apple likely to keep a market share of more than 50 percent until 2014, Gartner said.
Apple’s iPad may account for 73 percent of sales this year, after 83 percent last year. Apart from Apple and Android, no platform is expected to have more than 5 percent of the market this year, Gartner said.
“So far, Android’s appeal in the tablet market has been constrained by high prices, weak user interface and limited tablet applications,” Milanesi said.
Android tablets are expected to account for 17 percent of the market this year, up from 14 percent last year, Gartner said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
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