Taiwan’s optoelectronics industry posted a record output value last year by hitting NT$2.27 trillion (US$77.6 billion) amid strong international demand for Taiwanese solar components, LED lighting and electronic paper, the Photonics Industry and Technology Development Association (PIDA, 光電科技工業協進會) said yesterday.
The figure, up 37 percent from last year, smashed the record set in 2007, the association said.
The output value meant Taiwan seized an 18 percent share of the global optoelectronics market, Murphy Lin (林穎毅), director of PIDA’s industry and technology research division, told a media briefing.
“Flat-panel displays have led the growth of Taiwan’s optoelectronics industry for the last 10 years,” he said. “For the next five years, solar power and LED will take center stage.”
There have been signs supporting the trend, he said, as solar modules and solar systems reported the highest output growth last year among all optoelectronics products, by increasing 470 percent and 433 percent respectively.
The third-highest growth came from LED lighting, which expanded 130 percent, Lin said.
The output of the solar power sector is forecast to hit NT$299.8 billion in 2013, from NT$189.5 billion last year, according to PIDA’s statistics.
Asia has increased its weight in world solar battery production, with China commanding 38 percent of the production share last year, Taiwan taking 12 percent and Japan 11 percent, Lin said.
Production shares of Germany and the US were 14 percent and 13 percent respectively last year, the association said.
In terms of the LED sector, PIDA industrial analyst Deaphne Kuo (郭子菱) said the sector will see a boost as more Asian countries, such as Japan, Taiwan and China, deploy LEDs for street lamps and in government offices.
The falling price tags would also add to the attractiveness for people to buy LED lighting, she said.
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would