Qimonda Richmond LLC, a US semiconductor-making unit of Infineon Technologies AG, filed for bankruptcy protection from creditors, blaming the drop in global demand for computer chips.
The company, based in Sandston, Virginia, listed more than US$1 billion in both assets and debt in Chapter 11 documents filed on Friday in US Bankruptcy Court in Wilmington, Delaware. Qimonda North America Corp also filed for bankruptcy on Friday, court papers showed.
Qimonda is an affiliate of Qimonda AG, which is also a unit of Infineon. Qimonda AG, which primarily makes dynamic random access memory, or DRAM, for personal computers, filed for protection from creditors on Jan. 23 in Europe after failing to get sufficient financing following losses on memory-chip prices that have dropped below production costs.
Qimonda Richmond said it was forced to file for bankruptcy after its parent Qimonda AG filed for insolvency. The company said Qimonda AG stopped buying its inventory, resulting in a lack of funds to continue operations, court documents said.
“Toward the end of March 2007, prices for DRAM products fell precipitously,” Qimonda North America chief financial officer Miriam Martinez said in court filings.
The drop was a result of weak seasonal demand, coupled with computer manufacturers stockpiling inventory in anticipation of the release of Microsoft Corp’s Windows Vista operating system.
Average DRAM prices plummeted 85 percent in 2007 and fell an additional 58 percent last year, Martinez said in court papers, citing the market research firm DRAMeXchange.
Qimonda said it plans to “locate a purchaser expeditiously” for substantially all of its assets. The company will finance operations with about US$10.3 million in cash while in bankruptcy, court papers showed.
In related news, Spansion Inc, the money-losing maker of memory chips for mobile phones, said it failed to make an interest payment on US$266 million of bonds, which it now must repay in full.
Spansion first missed a payment on the notes on Jan. 15, and then failed to make good by the 30-day “cure” deadline, the Sunnyvale, California-based company said in a regulatory filing on Friday.
Spansion’s Japanese subsidiary filed for bankruptcy protection earlier this month. The parent company is in talks with holders of US$625 million of bonds due in 2013 about restructuring the debt and a possible sale or merger.
Spansion is the world’s largest producer of NOR flash, once the most common type of memory chip used in mobile phones before handset makers turned to cheaper NAND flash chips manufactured by Samsung Electronics Co and Toshiba Corp.
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would