Sunrise Department Store (中興百貨) promised to redeem NT$2.5 million (US$77,400) in vouchers in circulation should the store's concessionaires refuse to honor the vouchers, a company executive said yesterday.
"All vouchers can be cashed [at the counters] on the basement floor," Sunrise president Jeff Tsai (蔡振世) told reporters yesterday, one day after some concessionaires refused to accept Sunrise-issued vouchers and expressed concern over media reports of the retailer bouncing checks.
valid
Tsai assured consumers that all vouchers issued by the retailer remain valid, while rejecting media reports that it plans to shut down its Taipei store after bouncing NT$300 million in checks.
"We are experiencing some management difficulties and are seeking a new buyer," Tsai said. "But closure isn't an option."
Although the retailer owes NT$900 million in combined debts, Tsai said that it was not imperative for the company to shut down as it still had NT$2 billion in total assets.
He admitted that the company was facing a liquidity problem after some suppliers insisted on cashing their checks in advance.
The company is in talks with suppliers to ease the credit crunch and maintain normal operations, Tsai said.
Tsai attributed the department store's financial difficulties to a "sluggish economy," saying revenues during its anniversary sale promo early this month achieved less than 70 percent of its NT$350 million goal.
Formerly known as Sesame Department Store (
Sunrise was one of the first retailers to introduce upscale brands such as Armani in Taiwan, but slow business later forced the company to close two of its branches -- Xinyi in July 2004 and Hsinchu in July 2005 -- leaving a single outlet in Taipei.
competition
Like most other smaller players, Sunrise faces stiff competition from neighboring retailers, such as Breeze Center (
Meanwhile, retailer Idee Department Store's (
Idee, an affiliate of the debt-ridden Rebar Asia Pacific Group (
Shinkong spokesman and chief financial officer Kevin Ho (
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome