Taiwan's second-largest manufacturer of the flat panels used in slim computer displays and televisions, Chi Mei Optoelectronics Corp (
Chi Mei follows larger rival AU Optronics Corp (
The latest 5G fabs allow flat-panel manufacturers to produce panels for LCD televisions.
Last month, research firm DisplaySearch predicted that by 2007 33 percent of TFT-LCD panels will be used for television compared to 31 percent for computer displays.
This year only 9 percent of panels are destined for use in TVs.
The plant is expected to produce 120,000 sheets of the mother glass from which panels are cut by next year, Chi Mei's chairman Hsu Wen-long (
The new 5G panels measure 1.1m x 1.3m, from which a total of 12 17-inch, nine 19-inch or 20-inch, eight 22-inch or 23-inch, six 27-inch, or two 47-inch panels can be cut, the company said in a statement yesterday.
By the fourth quarter of the year, the new fab will begin the mass production of 17-inch and 27-inch panels, with 19-inch panels following in the first quarter of next year.
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome
People walk past advertising for a Syensqo chip at the Semicon Taiwan exhibition in Taipei yesterday.
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