China is "more than 90 percent certain" to adopt Japan's bullet-train technology to build a new multi-billion dollar high-speed rail line between Beijing and Shanghai, state press reported yesterday.
Although Transrapid International, a consortium comprising German industrial engineers ThyssenKrupp AG and Siemens AG, has not yet given up hope that China would adopt its magnetic levitation or Maglev train, its prospects look dim, the Economic Observer said, citing the Ministry of Railways.
Earlier this month, German media reported that China was unlikely to proceed with its plan to build the 1,300km line based on the German space-age technology.
A senior member of the Siemens' management team said that it had received "clear signals that the decision will be taken in favor of the traditional train technology."
Hopes had been high after Shanghai installed the 430km per hour Maglev for commercial use on a line between the city's Pudong airport and downtown.
Following its successful test run earlier this year, former Chinese premier Zhu Rongji (朱隆基) said China would build a second "maglev" line from Shanghai to the eastern city of Hangzhou in Zhejiang province.
It was expected that Beijing-Shanghai may follow suit.
However, competition has been fierce, with France's TGV and Japan's Shinkansen bullet train vying for a contract worth an estimated US$12 billion as well as other proposals to connect major cities in China by high-speed rail.
Japan's Transport Minister Chikage Ogi said last week she wants to visit China to promote Japan's bullet train.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome
Semiconductor equipment billings in Taiwan are expected to double this year, as manufacturers in the industry are keen to expand production to meet strong global demand for artificial intelligence applications, according to SEMI, which represents companies in the electronics manufacturing and design supply chain. Speaking at a news conference before the opening of Semicon Taiwan trade show tomorrow, SEMI director of industry research and statistics Clark Tseng (曾瑞榆) said semiconductor equipment billings in Taiwan are expected to grow by an annual 100 percent this year, beating an earlier estimate of 70 percent growth. He said that Taiwan received a boost from a