Joint venture wins rail project
A joint venture between Australian construction company Barclay Mowlem Rail Group and Teco Electric and Machinery Co (東元電機) secured a NT$3.3 billion contract to build the Tsoying Depot in southern Taiwan for the Taiwan High Speed Rail project, statements from both companies said yesterday.
The Tsoying Depot is expected to carry out routine inspections and service rolling stock for the new high-speed railway link between Taipei and Kaohsiung, which is scheduled to open in 2005.
The joint venture will construct 31 structures on the 40-hectare Tsoying site, including ballasted track rail sidings, rail storage areas and signaling facilities, and large steel-framed portal constructions and workshops.
China Airlines adding flights
China Airlines Co (華航) plans to add flights to Honolulu and Frankfurt to meet an increase in demand as the SARS epidemic subsides.
The carrier will add two flights a week to Honolulu from Taipei starting next Thursday, boosting the number to seven a week, public relations specialist Joseph Wu (武志厚) said. The airlines will also add a fourth weekly flight to Frankfurt starting two days later, he said.
China Airlines' sales fell 13 percent to NT$5.35 billion (US$156 million) last month from a year ago.
Taiwan may pay less for LNG
The state-run Chinese Petroleum Corp (中油) may pay less than US$3 per million British thermal units for liquefied natural gas (LNG) from Qatar, below the average price for the fuel in East Asia, Tex Report's Daily Energy edition said, without saying where it obtained the information.
The price to be paid by Chinese Petroleum for LNG from Qatar's Ras Laffan venture was based on an assumed oil price of US$20 per barrel, Tex said. LNG prices are typically set by a formula that's linked to benchmark oil prices.
Japanese buyers now pay an average US$3.80 per million British thermal units for LNG, based on the same assumed oil price, Tex said.
Chinese Petroleum last week won a NT$298.2 billion (US$8.7 billion) contract to supply the LNG bought from Qatar to Taiwan Power Co (台電) for 25 years starting in 2008.
DoCoMo urges share swap
NTT DoCoMo Inc, Japan's top mobile operator, wants its Taiwanese unit, KG Telecommunications Co (和信電訊), to swap shares with bigger rival Far EasTone Telecom-munications Co (遠傳電信) instead of cash for a merger to avoid losses, a Chinese-language newspaper reported, without citing its sources.
The paper said Far EasTone chairman Douglas Hsu (徐旭東) has a tentative agreement with NTT DoCoMo to swap shares, adding that Far EasTone's offer of NT$12 a share for KG Telecom would lead to losses on NTT DoCoMo's investment in KG Telecom.
Yang to quit bank job
Yang Tze-kaing (楊子江), who has been appointed vice minister of Finance, will quit his presidency at the China Development Industrial Bank (CDIB, 中華開發工銀) to take up his new job next Wednesday, the lender's parent company China Development Financial Holding Co (中華開發金控) said yesterday in a statement.
To replace Yang, the board of China Development Financial yesterday appointed Benny Hu (胡定吾), CDIB's chairman, to double as the bank's president.
NT dollar continues gains
The New Taiwan dollar yesterday continued its strength against its US counterpart, rising NT$0.009 to close at NT$34.341 on the Taipei foreign exchange market.
Turnover was US$1.054 billion.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass