Two companies under the Shin Kong Group -- Taishin Financial Holding Co (台新金控) and Shin Kong Financial Holding Co (新光金控) -- announced plans to merge yesterday, saying their combined assets will boost competitiveness.
"Both sides have expressed a willingness to merge -- a move that will create an entity with combined assets of about NT$1 trillion," Thomas Wu (
"It will be a merger of equals, with each accounting for NT$500 billion in assets."
The marriage will help enhance the cross-selling of financial products among the units under the combined entity, he said.
The merged company -- which will incorporate banks, insurance companies, security houses and bond underwriters -- will retain the name Taishin Financial Holding Co, Wu said.
After the merger, the new company will have around 9.7 million customers and more than 580 outlets nationwide. Currently, Taishin International Bank (
Netherlands-based semiconductor equipment supplier ASML Holding NV yesterday said that it is planning to hire an additional 1,000 people in Taiwan this year in response to growing demand from clients. ASML had previously planned to recruit 600 people this year, but that the plan has been adjusted upward, ASML vice president and ASML Taiwan general manager Grace Wang (汪佳慧) told reporters. ASML has a workforce of more than 4,500 in Taiwan, accounting for about 10 percent of its global total, Wang said. This year’s recruitment campaign would focus on adding people in the customer support, manufacturing and supply chain domains to assist ASML
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Huawei Technologies Co (華為) said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment. Right now there is about a five-year gap between what TSMC is capable of and what Huawei, together with its manufacturing partner Semiconductor Manufacturing International Corp (中芯), can produce. Huawei is to start making 1.4-nanometer chips by 2031 with its own “LogicFolding” technology, Huawei semiconductor chief He Tingbo (何庭波) said in a rare public appearance during a chip conference yesterday, while TSMC has
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