Taiwan and the UK on Thursday signed a deal that would pave the way for bilateral collaboration in talent development in the semiconductor sector, the Ministry of Foreign Affairs said.
The ministry in a statement issued yesterday said that the Taiwan-UK Memorandum of Understanding (MOU) on the Semiconductor Joint Skills Project was signed during a ceremony in Taipei.
Deputy Minister of Foreign Affairs Francois Wu (吳志中) said during the ceremony that the MOU marked “a milestone” in bilateral semiconductor cooperation, particularly given the two sides’ complementary strengths in the sector.
Photo courtesy of the Ministry of Foreign Affairs
British National Technology Adviser Dave Smith, who led a delegation to the Semicon Taiwan trade show in Taipei this week, echoed that view, saying that Taiwan’s advanced manufacturing capabilities and the UK’s strengths in innovation and research would complement each other, the statement said.
Smith said he was looking forward to further collaboration between Taiwan and the UK in fields such as compound semiconductors, silicon photonics and quantum technologies.
The MOU was signed by UK Representative to Taiwan Ruth Bradley-Jones and Representative to the UK Vincent Yao (姚金祥) via videoconference from London, the ministry said.
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