Tourists visit Iguazu Falls in Foz do Iguacu, Brazil, on Wednesday, after heavy rains across the river basin increased water flow.
Photo: Reuters
EXPANSION: The 3-hectare site would include small clean rooms and laboratories as well as a world-class training base for advanced packaging talent, the company said Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is to establish a presence in the Baipu Industrial Park (白埔產業園區) in Kaohsiung to accelerate the testing and validation of semiconductor materials and equipment, a company executive said on Tuesday. The company is working with the Ministry of Economic Affairs and the Kaohsiung City Government on the plan, which is expected to improve validation efficiency by 25 to 50 percent, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC global summit held ahead of the Semicon Taiwan trade show, which opened in Taipei yesterday. TSMC would also conduct
Visitors look at a 64-qubit superconducting quantum computer on display at the Fujitsu booth at the Semicon Taiwan trade show in Taipei yesterday.
Silicon photonics would play a dominant role next year and make chip-level co-packaged optics (CPO) packaging possible, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. “For years, critics questioned the reliability of CPO. The doubts are being thoroughly dismantled by real-world data and market validation,” TSMC vice president of advanced packaging technology development K.C. Hsu (徐國晉) said at a SEMI forum in Taipei. The company is on track to enter production of CPO later this year, Hsu said in another forum arranged by Imec in Taipei yesterday, about four months after TSMC announced its progress in CPO development in May.
EXPANDING: Firms are accelerating commercialization of the technologies as the industry moves beyond chip-level speeds to upgrading rack-to-rack links, SEMI said Silicon photonics and copackaged optics (CPO), technologies seen as critical to meeting the surging bandwidth demands of artificial intelligence (AI) infrastructure, would be among the main themes at the Semicon Taiwan trade show, which opens on Wednesday, event organizer SEMI said yesterday. The forum runs until Friday at the Taipei Nangang Exhibition Center, with technical forums beginning today. The event is expected to set a record in terms of the number of participants, SEMI said, projecting more than 1,300 exhibitors from 65 countries across 4,300 booths and more than 100,000 attendees. Optical interconnects underpinning AI infrastructure would be one of the highlights, with
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