Advanced Micro Devices Inc (AMD) yesterday said it is meeting with local ecosystem partners, including Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), to discuss strategies, including long-term manufacturing, to navigate uncertainties such as US tariffs, as Taiwan occupies an important position in global supply chains.
AMD chief executive officer Lisa Su (蘇姿丰) told reporters that Taiwan is an important part of the chip designer’s ecosystem and she is discussing with partners and customers in Taiwan to forge strong collaborations on different areas during this critical period.
AMD has just become the first artificial-intelligence (AI) server chip customer of TSMC to utilize its advanced 4-nanometer process technology in Arizona to produce its new server chip.
Photo courtesy of AMD
The US company is also working with TSMC to produce next-generation server chips, dubbed Venice, using 2-nanometer technology, paving the way for commercial launch next year, it said.
Su, who on Monday met with TSMC chairman and chief executive officer C.C. Wei (魏哲家) in Hsinchu, said that TSMC is at the center of AMD’s overall partnership ecosystem.
“We are discussing some strategies ... One is to think about what our long-term manufacturing strategy is, and then also some of the things that we will do in the short term to ensure that we continue to support our customers,” Su told reporters when asked what the discussions would involve.
“Of course, US manufacturing is a key priority for us as a US company,” Su said. “But we also have a lot of customers around the world, and we have a very strong partner network in our supply chain. So we will work with all of our partners to navigate some of these uncertainties.”
AMD is monitoring the tariff situation very carefully, Su said in response to a reporter’s question about the imminent semiconductor probes that the administration of US President Donald Trump said it would launch in preparation for levying more tariffs on imported chips.
Su said she had the chance to talk with the US government and would continue the discussions as part of the company’s overall manufacturing and research and development strategy.
“Well, I think when I look at all of the various things, the key point is that semiconductors are so important in the world,” Su said. “And I think this is one of the things that we have seen. So, every government is, of course, thinking about their policies.”
From AMD’s standpoint, the company wants a very resilient supply chain and Taiwan continues to be an important part of that supply chain, Su said.
But the US is also going to be very important, she added.
AMD is expanding its work in the US, including its collaboration with TSMC and other key supply chain partners, she said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
RSS