Intel Corp is to spin off assets that are not central to its mission and create new products including custom semiconductors to try to better align itself with customers,
chief executive officer Lip-Bu Tan (陳立武) said on Monday.
The US chipmaker needs to replace the engineering talent it has lost, improve its balance sheet and better attune manufacturing processes to meet the needs of potential customers, Tan said.
Photo: I-Hwa Cheng, AFP
Speaking at his first public appearance as CEO, at the Intel Vision conference in Las Vegas, Tan did not specify what parts of Intel he believes are no longer central to its future.
“We have a lot of hard work ahead,” he said, addressing the company’s customers in the audience. “There are areas where we’ve fallen short of your expectations.”
The veteran semiconductor executive is trying to restore the fortunes of a company that dominated an industry for decades, but now finds itself chasing rivals in most of the areas that define success in the field. A key question confronting its leadership is whether a turnaround is best served by the company remaining whole or splitting up its key product and manufacturing operations.
Tan gave no indication that he would seek to divest either part of Intel. Instead, he highlighted the problems he needs to fix to get both units performing more successfully.
Intel’s chips for data center and artificial intelligence (AI)-related work in particular are not good enough, he said.
“We fell behind on innovation,” he said. “We have been too slow to adapt and meet your needs.”
Tan, 65, assumed the role on March 18. He had been an Intel board member before stepping down in August last year.
The CEO said he has been asked why he took on the job this late in his career.
“It was very hard for me to see it struggle,” Tan said. “I simply could not stay on the sidelines knowing that I could help.”
Tan’s predecessor, Pat Gelsinger, was pushed out by the board for a perceived failure to rejuvenate Intel’s product lineup. One of the most glaring challenges: creating an AI accelerator chip to rival the products of Nvidia Corp. That company, once in Intel’s shadow, has seen its revenue and valuation skyrocket over the past two years due to the AI computing boom.
Gelsinger had also set out to turn Intel into a chip foundry — a contract manufacturer that makes products for outside clients — but that effort is still in its early stages.
Tan said the company needs to listen to prospective outside customers for its factories and let them specify the design and manufacture of their products, rather than Intel dictating the way it would be done.
He said many large customers want custom parts — and his company will do it for them.
The CEO repeatedly emphasized that there is no quick fix to Intel’s problems, but that he is committed to staying at the company as long as it takes.
“It won’t happen overnight, but I know we can get there,” he said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass