Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday unveiled the layout of its new fab in Arizona and reiterated its determination to ramp up advanced 5-nanometer chip production in 2024.
The company said that construction of Fab 21, in which it would invest US$10 billion to US$12 billion, has begun on a 445 hectare plot in Phoenix.
“As we expect demand for 5-nanometer [chips] will be strong and sustainable in the long term, we have made the Arizona fab, Fab 21, one of the 5-nanometer manufacturing sites,” TSMC chief executive officer C.C. Wei (魏哲家) told the company’s annual technology symposium.
Photo: Grace Hung, Taipei Times
The chipmaker has shipped more than 500,000 5-nanometer chips from its Fab 18 in Tainan since the technology became available last year, thanks to robust customer demand for smartphones, 5G applications, artificial-intelligence (AI) applications, networking devices and high-performance computing devices, Wei said.
The first phase of the Arizona fab would have an installed capacity of 20,000 wafers a month, TSMC said.
In January, the chipmaker said that further expansion would depend on market conditions and US government support.
TSMC yesterday introduced the technology for its new N5A process to produce 5-nanometer chips for automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits.
Production using the N5A process is scheduled to be available in the third quarter of next year, Wei said.
The chipmaker said that its 3-nanometer technology would be the world’s most advanced technology when volume production begins in the second half of next year.
Its fabs in Tainan would be its major manufacturing sites for 3-nanometer chips, TSMC said.
To expedite mass production of 3-nanometer and 2-nanometer chips, TSMC is transforming its 2-nanometer research centers in Hsinchu into sites for initial production of new-generation chips, it said.
TSMC has been boosted capacity to catch up with customers' rising demand,expecting that its advanced technology capacity would expand at a compound annual rate of 30 percent from 2018 to this year.
Among advanced technologies,7-nanometer chip capacity would have increased fourfold until this year since 2018, TSMC senior vice president Y.P. Chin (秦永沛) told the symposium.
Five-nanometer chip capacity would quadruple until 2023 from last year’s level, he said.
The company is also expanding its advanced chip testing and packaging capacity to cope with growing demand, Chin said.
TSMC is building its fifth fab in Miaoli County’s Jhunan Township (竹南), which would offer the most advanced 3D packaging technology of system-on-integrated-chip in the second half of next year, he said.
On Tuesday, US President Donald Trump weighed in on a pressing national issue: The rebranding of a restaurant chain. Last week, Cracker Barrel, a Tennessee company whose nationwide locations lean heavily on a cozy, old-timey aesthetic — “rocking chairs on the porch, a warm fire in the hearth, peg games on the table” — announced it was updating its logo. Uncle Herschel, the man who once appeared next to the letters with a barrel, was gone. It sparked ire on the right, with Donald Trump Jr leading a charge against the rebranding: “WTF is wrong with Cracker Barrel?!” Later, Trump Sr weighed
HEADWINDS: Upfront investment is unavoidable in the merger, but cost savings would materialize over time, TS Financial Holding Co president Welch Lin said TS Financial Holding Co (台新新光金控) said it would take about two years before the benefits of its merger with Shin Kong Financial Holding Co (新光金控) become evident, as the group prioritizes the consolidation of its major subsidiaries. “The group’s priority is to complete the consolidation of different subsidiaries,” Welch Lin (林維俊), president of the nation’s fourth-largest financial conglomerate by assets, told reporters during its first earnings briefing since the merger took effect on July 24. The asset management units are scheduled to merge in November, followed by life insurance in January next year and securities operations in April, Lin said. Banking integration,
LOOPHOLES: The move is to end a break that was aiding foreign producers without any similar benefit for US manufacturers, the US Department of Commerce said US President Donald Trump’s administration would make it harder for Samsung Electronics Co and SK Hynix Inc to ship critical equipment to their chipmaking operations in China, dealing a potential blow to the companies’ production in the world’s largest semiconductor market. The US Department of Commerce in a notice published on Friday said that it was revoking waivers for Samsung and SK Hynix to use US technologies in their Chinese operations. The companies had been operating in China under regulations that allow them to import chipmaking equipment without applying for a new license each time. The move would revise what is known
Artificial intelligence (AI) chip designer Cambricon Technologies Corp (寒武紀科技) plunged almost 9 percent after warning investors about a doubling in its share price over just a month, a record gain that helped fuel a US$1 trillion Chinese market rally. Cambricon triggered the selloff with a Thursday filing in which it dispelled talk about nonexistent products in the pipeline, reminded investors it labors under US sanctions, and stressed the difficulties of ascending the technology ladder. The Shanghai-listed company’s stock dived by the most since April in early yesterday trading, while the market stood largely unchanged. The litany of warnings underscores growing scrutiny of
RSS