The central bank on Friday met with 36 domestic lenders, asking them to comply with risk management requirements and refrain from cutthroat competition in mortgage operations.
The plea came after housing and construction lending continued to grow last quarter despite two waves of selective credit controls intended to cool the local property market.
The central bank said it has since January been inspecting mortgage operations and found that most lenders abide by risk management rules.
Photo: Tyrone Siu, Reuters
However, some lenders failed to exercise caution by offering interest rates that were below market average, it said.
“Banks must factor in funding costs, operating overhang, potential credit losses and other things when setting interest rates for real-estate property lending,” the central bank said in a statement released after the closed-door meeting.
The central bank has held several meetings over the past few months calling for self-restraint on the part of lenders, aiming to curb hikes in property prices caused by low interest rates and excessive liquidity after global central banks printed money to ease the effects of the COVID-19 pandemic.
Under-par interest rates are unfavorable for risk controls and pose a threat to the stability of the nation’s financial market, the central bank said, asking top executives at local banks to oversee internal pricing practices.
The central bank had earlier said it was displeased that local lenders’ housing and construction lending had not yet responded to credit tightening it introduced in December last year and March.
The central bank said that some officials have suggested more drastic steps to rein in the property market, while others believe more time is needed to judge the success of credit controls.
Central bank Governor Yang Chin-long (楊金龍) has told lawmakers that, if necessary, he might further tighten lending terms at the bank’s quarterly board meeting next month.
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would