Wistron Corp’s (緯創) board of directors has agreed to expand the company’s server production capacity at home and abroad, as well as sell its mobile phone business in China’s Kunshan in January, the company said last week.
The contract electronics maker — whose products include handsets, servers, laptops, PCs, tablets, video game consoles and LCD modules — has been expanding its non-Chinese production capacity over the past year, including in Taiwan, India, Malaysia, Vietnam and even in Texas, amid US-China trade tensions and geopolitical uncertainties.
The company’s board on Thursday approved a proposal to invest US$28 million in Wistron InfoComm Technology (Texas) Corp to add server production capacity at its Mexican plant to support exports to the US, according to company regulatory filings.
Photo: David Chang, EPA-EFE
The board also agreed to lease a plant owned by solar module supplier United Renewable Energy Co (聯合再生能源) in Hsinchu County’s Hukou Township (湖口) for NT$13.02 million (US$451,347) per month as Wistron aims to expand its server assembly capacity in Taiwan, regulatory filings showed.
As for its handset business, the company has reached a deal with China’s Luxshare Group (立訊集團) to sell its Kunshan plant for 3.3 billion yuan (US$499.52 million) and the board on Thursday agreed to close the deal on Jan. 1, while increasing investment in India, the filings showed.
“Wistron will invest more resources in profitable businesses after the disposal of its handset segment,” Yuanta Securities Investment Consulting Co (元大投顧) analysts led by Harvey Kao (高啟瑋) said in a note on Friday. “As the company will lean more on its server business going forward, we expect the contribution from server sales to rise from 27 percent this year to more than 35 percent next year.”
Its server business would become a key sales driver for Wistron next year, as the company’s notebook computer and LCD module businesses are likely to see flat sales compared with this year, while the PC segment would likely see mild market share gains, driven by more order wins from US clients, Yuanta said.
Wistron on Thursday reported third-quarter net profit of NT$2.78 billion, up 61.67 percent from a year earlier, while earnings per share rose from NT$0.61 to NT$1.
Gross margin increased to 5.37 percent, from 5 percent, thanks to a favorable product mix and contribution from its cloud computing equipment subsidiary Wiwynn Corp (緯穎科技).
Foreign-exchange gains of NT$240 million from effective hedging also lent support to margin performance.
In the first three quarters, net profit totaled NT$6.36 billion, or earnings per share of NT$2.26, and gross margin came in at 5.38 percent, the company said.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) secured a record 70.2 percent share of the global foundry business in the second quarter, up from 67.6 percent the previous quarter, and continued widening its lead over second-placed Samsung Electronics Co, TrendForce Corp (集邦科技) said on Monday. TSMC posted US$30.24 billion in sales in the April-to-June period, up 18.5 percent from the previous quarter, driven by major smartphone customers entering their ramp-up cycle and robust demand for artificial intelligence chips, laptops and PCs, which boosted wafer shipments and average selling prices, TrendForce said in a report. Samsung’s sales also grew in the second quarter, up
LIMITED IMPACT: Investor confidence was likely sustained by its relatively small exposure to the Chinese market, as only less advanced chips are made in Nanjing Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) saw its stock price close steady yesterday in a sign that the loss of the validated end user (VEU) status for its Nanjing, China, fab should have a mild impact on the world’s biggest contract chipmaker financially and technologically. Media reports about the waiver loss sent TSMC down 1.29 percent during the early trading session yesterday, but the stock soon regained strength and ended at NT$1,160, unchanged from Tuesday. Investors’ confidence in TSMC was likely built on its relatively small exposure to the Chinese market, as Chinese customers contributed about 9 percent to TSMC’s revenue last
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17