The nation’s housing price index in the second quarter of this year rose 0.67 percent from three months earlier to 105.9 as home prices picked up across Taiwan on the back of real demand and asset allocation needs, Ministry of the Interior data showed.
Tainan reported the biggest advance at 1.31 percent, followed by Taichung’s 1.19 percent, Taoyuan’s 0.68 percent and Kaohsiung’s 0.38 percent gain, the data showed.
Housing prices inched up 0.2 percent in Taipei and 0.09 percent in New Taipei City.
Photo: Ann Wang, Reuters
The price hikes came even though Taiwan’s GDP contracted 0.58 percent during the April-to-June period when the COVID-19 pandemic inhibited consumer spending, but failed to weaken interest in real estate.
Deputy Minister of the Interior Hua Ching-chun (花敬群) said the price increase had to do with improving infrastructure in central and southern Taiwan, which explains why the uptick was less evident in the greater Taipei area.
Compared with a year earlier, the housing price index grew at an average of 1.38 percent, the data showed.
Meanwhile, housing affordability improved as the average mortgage burden fell 0.66 percent from the previous quarter and 1.42 percent from a year earlier to 34.64 percent, the ministry said.
Lower borrowing costs accounted for lower mortgage burdens in almost all parts of Taiwan except Taipei, it said.
The central bank in March cut the rediscount rate to a record low of 1.125 percent in the hope of easing financial burden on households amid the pandemic.
State-run and private lenders took the cue and reduced their interest rates.
Mortgage burden declined 2.58 percent in Taichung, fell 1.9 percent in New Taipei City and shrank 0.92 percent in Taoyuan, the ministry said.
Tainan and Kaohsiung saw mortgage payments softening 0.63 percent and 0.75 percent respectively, it said.
Taipei bucked the decline with a 0.51 percent gain to 57.57 percent, it said.
GROWING OWINGS: While Luxembourg and China swapped the top three spots, the US continued to be the largest exposure for Taiwan for the 41st consecutive quarter The US remained the largest debtor nation to Taiwan’s banking sector for the 41st consecutive quarter at the end of September, after local banks’ exposure to the US market rose more than 2 percent from three months earlier, the central bank said. Exposure to the US increased to US$198.896 billion, up US$4.026 billion, or 2.07 percent, from US$194.87 billion in the previous quarter, data released by the central bank showed on Friday. Of the increase, about US$1.4 billion came from banks’ investments in securitized products and interbank loans in the US, while another US$2.6 billion stemmed from trust assets, including mutual funds,
Micron Memory Taiwan Co (台灣美光), a subsidiary of US memorychip maker Micron Technology Inc, has been granted a NT$4.7 billion (US$149.5 million) subsidy under the Ministry of Economic Affairs A+ Corporate Innovation and R&D Enhancement program, the ministry said yesterday. The US memorychip maker’s program aims to back the development of high-performance and high-bandwidth memory chips with a total budget of NT$11.75 billion, the ministry said. Aside from the government funding, Micron is to inject the remaining investment of NT$7.06 billion as the company applied to participate the government’s Global Innovation Partnership Program to deepen technology cooperation, a ministry official told the
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), the world’s leading advanced chipmaker, officially began volume production of its 2-nanometer chips in the fourth quarter of this year, according to a recent update on the company’s Web site. The low-key announcement confirms that TSMC, the go-to chipmaker for artificial intelligence (AI) hardware providers Nvidia Corp and iPhone maker Apple Inc, met its original roadmap for the next-generation technology. Production is currently centered at Fab 22 in Kaohsiung, utilizing the company’s first-generation nanosheet transistor technology. The new architecture achieves “full-node strides in performance and power consumption,” TSMC said. The company described the 2nm process as
JOINT EFFORTS: MediaTek would partner with Denso to develop custom chips to support the car-part specialist company’s driver-assist systems in an expanding market MediaTek Inc (聯發科), the world’s largest mobile phone chip designer, yesterday said it is working closely with Japan’s Denso Corp to build a custom automotive system-on-chip (SoC) solution tailored for advanced driver-assistance systems and cockpit systems, adding another customer to its new application-specific IC (ASIC) business. This effort merges Denso’s automotive-grade safety expertise and deep vehicle integration with MediaTek’s technologies cultivated through the development of Media- Tek’s Dimensity AX, leveraging efficient, high-performance SoCs and artificial intelligence (AI) capabilities to offer a scalable, production-ready platform for next-generation driver assistance, the company said in a statement yesterday. “Through this collaboration, we are bringing two