Indonesia’s economy contracted in the third quarter, plunging it into its first recession since the archipelago was mired in the Asian financial crisis more than 20 years ago.
Activity in Southeast Asia’s biggest economy in the July-to-September period slumped 3.49 percent from a year earlier, Statistics Indonesia said yesterday, with tourism, construction and trade among the hardest-hit sectors.
The data marked the second consecutive quarter of contraction after a 5.3 percent decline in the April-to-June period.
Photo: AFP
However, the depth of the current decline was easing, Statistics Indonesia said.
The economy “continues showing a contraction year-over-year, but the quarter-on-quarter recovery was quite strong,” said Anwita Basu, head of Asia Country Risk at Fitch Solutions in Singapore, highlighting a gradual pickup in manufacturing. “Some government efforts to continue with public works are reflected in that.”
Indonesia’s economy was also in better shape than two decades ago, with once-troubled commercial banks now stronger and ample foreign currency reserves at the central bank, Basu said.
Governments around the world have been struggling to contain the COVID-19 pandemic, which has forced the shutdown of vast parts of the global economy.
Bank Indonesia cut interest rates several times this year in a bid to boost the struggling economy, while the Indonesian government has unveiled more than US$48 billion in stimulus to help offset the impact a large-scale shutdown amid the pandemic that hammered growth.
Several million Indonesians have been laid off or furloughed as the vast country, home to nearly 270 million people, has battled to contain the virus.
Indonesian President Joko Widodo has been widely criticized over his government’s handling of the pandemic, as it appeared to prioritize the economy.
Boosting annual growth above 5 percent had been a key priority for Widodo in his second term, which began late last year.
On Monday, the president signed into law a package of bills aimed at cutting red tape and drawing more foreign investment as he pushes an infrastructure-focused policy.
However, the legislation has sparked mass protests in cities across the nation, as critics say that it would be catastrophic for labor and environmental protections.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass