More Taiwanese investments in Europe would yield economic gains and closer ties, European Economic and Trade Office in Taiwan Director Filip Grzegorzewski told a news conference yesterday ahead of the office’s first European Investment Forum in Taipei on Tuesday next week.
With one-quarter of Taiwan’s foreign direct investment being from the EU while only 2 percent of Taiwan’s outgoing investment going to the bloc, Grzegorzewski said he hoped that the forum would encourage more Taiwanese investment in Europe, resulting in stronger connections.
“We make jobs here [in Taiwan], we help Taiwan grow into an international economy,” he said. “Now we are attracting Taiwanese investment to Europe to balance this economic relationship, basically also to make sure our bond is strong. The more interactions we have, the more connected we get.”
Photo: Chien Jung-fong, Taipei Times
The forum, which seeks to pave the way for closer Taiwan-EU business cooperation in the post-COVID-19 world economy, would feature presentations on the information and communications technology, automotive and health industries in Europe, Grzegorzewski said.
Taiwanese businesses would share their experiences of investing in the EU, he said.
There is to be an investment fair at which Taiwanese investors can talk to representatives from EU member states directly to facilitate bilateral collaborations, he said.
Taiwanese firms can further expand their markets by investing in EU member states, leveraging from the 41 trade agreements the regional bloc has signed with 72 countries, he said.
Grzegorzewski said he is often asked why there is no European equivalent of the “Select USA” program, which introduces Taiwanese firms to opportunities in the US.
“This forum is the first step,” he said.
When asked whether trade ties with the EU might be affected by pressure from China, Minister of Foreign Affairs Joseph Wu (吳釗燮) told the news conference that Taiwan would not be intentionally provocative, but would keep on doing business.
“Going back decades now, China has never stopped threatening Taiwan with the use of force. And while the pressure has increased over the past few years, Taiwan is still a top investment destination in Asia and continues to be heavily favored by European investors,” Wu said.
Taiwan would continue with its policy of not rocking the boat, while keeping an eye on Chinese threats, he said.
“I believe that raising Taiwan’s visibility in Europe and Europe’s visibility in Taiwan is very important,” Wu said.
“I am sure we have all seen that the Taiwan-European relationship has been strengthening by leaps and bounds in the past year or two,” he said, citing the 90-member delegation that Czech Senate President Milos Vystrcil led to Taiwan.
The forum is to take place at the Taipei International Convention Center.
It is co-organized by the European Economic and Trade Office, EU member states’ representative offices, the Ministry of Economic Affairs and the Ministry of Foreign Affairs.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass