Wistron Group (緯創集團) yesterday announced a strategic partnership with Microsoft Corp Taiwan’s artificial intelligence research and development center, whereby the two firms would create an office in Kaohsiung for artificial intelligence and big data-related products and services.
Wistron is also to invest NT$50 million (US$1.69 million) over the next two years to develop new talent in the area, Wistron Corp (緯創資通) vice chairman Robert Huang (黃柏漙) told a news conference in Taipei.
The office is part of the contract electronics manufacturer’s “digital transformation” from an original design manufacturer into a technology service provider, Huang said.
Photo: CNA
“Big data is not just for big business … it is the company’s mission to help all businesses embrace digital technology,” he said.
The Kaohsiung office is to have a strong emphasis on the cultivation of talent, as “we are growing people, not factories,” he added.
Artificial intelligence technologies are being developed for many different industries, and Wistron, in conjunction with Microsoft, plans to use its resources, as well its subsidiary WiAdvance Technology Co’s (緯謙科技) expertise in corporate digital transformation and smart manufacturing, to address various challenges facing local industries, Huang said.
Huang also serves as chairman of WiAdvance.
Tragedies such as the fire that killed six people at a karaoke parlor in Taipei in April could be avoided if inspectors could continually monitor firefighting equipment online, WiAdvance senior technology director Raymond Fan (范振煌) said.
Smart technology could also assist with disease prevention efforts by tracking individual’s movements and body temperature without compromising their privacy, he said.
As an example, Wistron has provided En Chu Kong Hospital (恩主公醫院) in New Taipei City’s Sanxia District (三峽) with a smart healthcare system incorporating remote capabilities.
The system allows medical instructions to be passed to patients and doctors to inspect how wounds are healing remotely, the company said.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
RSS