Toyota Motor Corp is to partly resume operations at three plants in China this week, bringing back some of the capacity that had been on an extended halt in response to the COVID-19 outbreak that has pitched Asia’s top economy into turmoil.
The factories in Changchun and Guangzhou would restart today, while operations in Tianjin resume tomorrow, Toyota spokesman Kensuke Ko said in an e-mail.
The plant in Chengdu would restart after next week, he said.
The spread of the virus has weighed on the global economy, with some automakers extending plant shutdowns amid shortages of parts and as efforts to combat the outbreak impeded the flow of workers.
An initial plan by Toyota to reopen factories on Sunday last week was delayed.
Fellow Japanese automaker Honda Motor Co has said it plans to restart its China manufacturing operations this week.
It is hard to pin down a reason for the delay in resuming operations at the Chengdu plant, Ko said.
The supply chain for parts and government policies are some of the factors, he added.
Yesterday, the government of Hubei Province, the center of China’s COVID-19 outbreak, said a ban would be imposed on vehicle traffic across the province to curb the spread of the virus.
In a published document, it said police cars, ambulances, vehicles carrying essential goods or other vehicles related to public service would be exempted.
It added that the province would carry out regular health checks on all residents in the province. It also said that companies cannot resume work without first receiving permission from the government.
The outbreak could barely have come at a worse time for struggling automakers.
Hubei’s Capital, Wuhan, is a major center of automotive manufacturing.
France’s Renault SA and PSA Peugeot Citroen, Germany’s Volkswagen AG and BMW AG, as well as Jaguar Land Rover Automotive PLC, Britain’s largest carmaker, have still not reopened factories run with Chinese partners.
Hyundai Motor Co has shut its huge factory in Ulsan, South Korea, for lack of parts, while Fiat Chrysler Automobiles NV warned production in Europe could be threatened within two weeks.
Nissan Motor Co has already paused production lines at its Japanese plants.
Additional reporting by Reuters and The Guardian
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It