Leading kitchen appliance and water heater supplier Taiwan Sakura Corp (台灣櫻花) is to invest NT$1.3 billion (US$41.56 million) in Taiwan, the Ministry of Economic Affairs said yesterday as it approved the firm’s application along with five others to invest back home.
Taiwan Sakura, which operates three manufacturing facilities in Taichung’s Shengang (神岡), Daya (大雅) and Wufeng (霧峰) districts, said earlier this year that it would set up another plant in Wufeng to handle rising demand.
The company’s investment plans show that Taiwan Sakura is to renew machinery equipment and introduce automated production systems at its Shengang and Daya plants, the ministry said, adding that the investment is expected to provide about 30 job opportunities.
Tire maker Federal Corp (泰豐輪胎) plans to invest NT$3.2 billion as it aims to relocate its Chinese production to Taiwan by setting up a plant at the Taoyuan High-Tech Industrial Park (桃園科技工業園區), which is expected to provide about 258 new jobs, the ministry said.
TSRC Corp (台橡) is to expand its production line of high-end shoe materials at its plant in Kaohsiung’s Gangshan District (岡山).
Cosmetics company Luo Lih-Fen Holding Co (羅麗芬控股) is to invest NT$1.4 billion in a plant and a laboratory in New Taipei City through its biotech unit in cooperation with Tzu Chi Hospital, the ministry said.
Sysgration Ltd (系統電子), which provides industrial Internet of Things solutions, automotive electronics and energy storage systems, plans to add an automated production line at its plant at the Nantou Nangang Industrial Park (南投南崗工業區) to reduce costs, as the company ships 92 percent of its China-made products to the US, the ministry said.
The company plans to invest NT$400 million and provide up to 400 job opportunities, the ministry said.
P-Duke Technology Co (博大科技), which specializes in the production and sales of DC/DC converters and related products, plans to invest more than NT$1.2 billion by setting up a new plant at the Taichung Industrial Park (台中工業區) and recruiting 230 people, the ministry said.
Since the program was launched at the start of this year, a combined NT$576.7 billion in investments from 129 companies has been approved, providing up to 50,609 job opportunities, the ministry said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
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