Machvision Inc (牧德), a supplier of printed circuit board (PCB) inspection equipment, on Tuesday last week said its performance this quarter might not follow the seasonal pattern, as growth momentum is supported by products launched last year.
Chairman Collin Wang (汪光夏) told an investors’ conference that although the first quarter is typically a slow season for the company, he expects this quarter to be better than usual, as order visibility remains clear.
PCBs are essential parts that routes electrical signals between electronic parts.
With growing demand for different types of PCBs in the communication, computer and automotive industries, the global PCB market is expected to grow at a compound annual growth rate (CAGR) of 6 percent from last year to 2021, industry researcher Technavio said.
Consequently, demand for the quality inspections of PCBs is increasing and Technavio’s market research indicates that the market for PCB inspection equipment in the Asia-Pacific region could grow at a CAGR of close to 15 percent from last year to 2021.
Founded in 1998, Hsinchu-based Machvision provides automated optical inspection (AOI) solutions for PCB and integrated circuit (IC) manufacturing.
The company last month saw revenue grow 180.11 percent year-on-year to NT$178 million (US$6.05 million), a record high. Last year as a whole, revenue totaled NT$1.421 billion, up 74.47 percent annually, with the sales mix by product including flexible PCB inspection equipment (39 percent), AOI equipment for rigid PCBs (19 percent) and IC inspection equipment (5 percent), company data showed.
The company’s new full-scan system with enhanced measurement specifications for both PCB and flexible PCB (FPCB) would begin shipments to customers in March, Wang said.
The company developed the system in February last year and launched it at a trade show organized by the Taiwan Printed Circuit Association (TPCA) in October, he added.
Separately, PCB automation machine supplier SynPower Co Ltd (聯策), FPCB producer Career Technology Co (嘉聯益) and Pomiran Metalization Research Co (柏彌蘭金屬化研究) on Wednesday last week launched an industrial alliance to help local FPCB makers tap business opportunities in the 5G mobile networks field and to better compete with Japanese and South Korean rivals.
The alliance, which is supported by the government-funded Industrial Technology Research Institute (ITRI, 工研院) and the Institute for Information Industry (資策會), said it aims to help local makers establish high-value added FPCB production lines and enhance their global competitiveness.
The nation’s FPCB industry had a production value of US$3.95 billion in 2016, accounting for 38 percent of the world’s total, TPCA statistics showed.
The global production value of FPCB is expected to increase from US$12.6 billion last year to US$13 billion this year, with Taiwanese makers continuing to play an important role in supply chains, ITRI’s Industrial Economics and Knowledge Center (產業經濟與趨勢研究中心) said on Wednesday last week.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass