China stepped up pressure on foreign automakers in the world’s biggest auto market on Wednesday, pledging to punish German luxury brand Audi AG and the US’ Chrysler Group LLC for “monopoly behavior.”
China’s National Development and Reform Commission (NDRC), which polices violations of the Chinese anti-monopoly law, has been investigating the sector — dominated by foreign companies and their joint ventures — for more than two years but had not mentioned any particular firms.
Audi is the luxury car unit of Volkswagen AG, Europe’s biggest automaker, while Chrysler has merged with Italy’s Fiat spA.
“It has been found out that the two companies showed monopoly behavior and they will be punished accordingly in the near future,” NDRC spokesman Li Pumin (李樸民) told a news conference in Beijing.
A spokesman for Fiat-Chrysler in China declined to comment, while Audi could not be reached.
The NDRC announcement came two days after anti-monopoly investigators from the agency raided a Shanghai office of Mercedes-Benz, a luxury unit of Germany’s Daimler AG, by grilling employees and inspecting computers.
Li confirmed the investigation into Mercedes-Benz, according to a transcript of the news conference posted online. Daimler said on Tuesday that it was “assisting” the inquiry.
China is critically important for foreign automakers with total sales of 21.98 million vehicles last year.
Regulators believe prices for both parts and vehicles are unfairly high in the country, but manufacturers say authorities impose heavy duties on imported cars and parts, which ramp up costs for domestic consumers.
Li did not clarify what was meant by “monopoly behavior,” but China considers using a dominant market position to set prices as a form of monopoly.
Violators’ “illegal gains” can be confiscated, and they can also be fined up to 10 percent of their sales revenue for the previous year.
Another 12 Japanese automakers were under investigation for monopoly pricing of vehicle components and bearings, Li said, but declined to name them, adding that details would be released later.
Auto companies have rushed to cut prices in recent weeks in an apparent bid to appease Beijing.
On Sunday, Daimler announced it would slash prices of more than 10,000 spare parts for its Mercedes-Benz cars in China from Sept. 1, according to a statement that linked the move to investigations of the entire auto industry in China.
Audi lowered its prices for spare parts last week, it said in a statement, while Chrysler said on Tuesday it would slash prices for both parts and some of its Jeep models, Dow Jones Newswires reported.
The NDRC spokesman said the anti-monopoly investigations started at the end of 2011, but analysts say China has recently escalated them.
Last week, China’s State Administration for Industry and Commerce said it was investigating US software company Microsoft Corp for allegedly operating a monopoly after raiding four of its offices around the country. The administration, which also enforces the anti-monopoly law, said that the inquiry centers on Microsoft’s Windows operating system — which is used on the vast majority of computers in China — and the Office suite of programs.
Chinese media outlets have reported that Beijing is planning to announce US chip maker Qualcomm Inc has monopoly status in the cellphone chip market.
Chinese authorities investigated British drugmaker GlaxoSmithKline (GSK) PLC following allegations it systematically offered bribes to doctors and hospitals and passed the cost on to consumers through high prices.
Following a 10-month probe, police said in May that GSK’s former head of China operations and two other executives authorized the bribery.
Last year, China fined six baby formula producers — all but one of them foreign — a total of US$108 million for price-fixing.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It