After the TAIEX surged above the 6,000-point mark on Wednesday, stocks yesterday fell 0.38 percent as a result of shrinking trading values and foreign purchases of electronics stocks, a market watcher said.
The TAIEX shed 22.94 points to close at 6,026.55 on the Taiwan Stock Exchange. Turnover was NT$72.87 billion (US$2.23 billion), down from NT$103 billion on Thursday, when the benchmark rose to 6,049.49, the highest level in five weeks. Decliners outnumbered advancers 340 to 263, while 174 stocks stayed unchanged. Fifteen stocks were limit-up and 3 stocks dropped limit-down.
Foreign investors bought a net NT$4.89 billion worth of local equities yesterday, significantly less than the NT$11.5 billion on Thursday. The market has seen foreign capital inflow amounting to NT$119.5 billion in the first 19 days of this month, according to figures released by the Taiwan Stock Exchange.
"The minor decline is healthy, because, based on the historical experience, the index has often fluctuated several times while meeting the yearly benchmark [6,043 points this year] before rising further," said Calvin Chen (陳程坤), an associate manager at Yuanta Core Pacific Capital Management (元大京華投顧).
The bourse is expected to continue fluctuating in a small range next week, Chen said.
According to a report by JP Morgan Chase Bank, the market is likely to continue its upward trend in the near future.
"We remain positive on Taiwanese equities and forecast the index to reach 10,000 by the year 2005," Krista Yue (
The bank suggested five stock picks: Cathay Financial Holding Co (
"We are staying long financials and broadening exposure to other beneficiaries of reflation such as retailers that are most sensitive to a rise in discretionary spending," the bank said in the report.
JP Morgan suggested avoiding Compal Electronics Inc (
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
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SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
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