Share prices of Coretronic Corp (
The company expects rear-projection, or digital light processing (DLP), projector shipments to rise to around 400,000 units this year from 170,000 units last year, spokesperson Cindy Wen (溫慧萍) said yesterday.
At an investor conference held on Monday in Taipei, chairman Wade Chang (張威儀) said the company would sell all it could produce and expected sales to rise to about NT$10 billion a year within five years.
"We're optimistic that we can hit that target," Wen said.
The top projector maker reported after-tax income for last year of NT$770 million, or NT$2.01 a share, on revenues of NT$23.9 billion, up 40 percent from the previous year.
Investors welcomed the company's forecast, sending shares of Coretronic up 7 percent to close at NT$42 on the TAIEX.
"It is highly possible that Coretronic could earn more this year due to growing demand for home-theater projectors because of falling retail prices," said Helen Chen (陳佩君), an analyst at Polaris Securities Group (寶來證券).
Chen forecast that Coretron-ic's earnings will double to NT$3.95 a share, in line with shipment growth this year.
Despite the downward pressure on projector prices, Coretronic will be able to sustain its gross margin at around 10.26 percent, the analyst said.
But the uncertain supply of key components such as bulbs could hurt the company's ability to reach the target, she warned.
A recent report released by market researcher Market Intelligence Center (MIC, 市場情報中心) showed that Taiwan's digital projector shipments for this year will rise to around 751,000 units, from 394,000 units last year.
"Digital projectors, which used to be a corporate-oriented product, are now making it onto the shopping list of general consumers," said MIC analyst Annabelle Hsu (
A sharp price decline during the second half of last year has spurred demand for home projectors, she added.
As projector prices fell to US$1,000 each, consumers have been more willing to choose digital projectors, rather than pricey flat-screen televisions, as a major part of their home entertainment systems, Hsu said.
"That will be a boon for digital projector manufacturers," Hsu said.
In addition to digital projectors, Coretronic also diversified into flat-screen televisions last year by producing plasma display panels (PDP) and rear-projection TVs mostly on a contract basis.
But the shipment volume remained small, with Coretronic producing just 1,000 PDP TVs and 5,400 rear-projection TVs during the last quarter, Wen said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome