Stocks fell for a second day yesterday. Taiwan Semiconductor Manufacturing Co (TSMC,
The TAIEX shed 19.60, or 0.3 percent, to 6,041.86. Almost the same number of stocks rose as fell. The futures index shed 0.4 percent to 6,051. About 5.2 billion shares changed hands, 24 percent above the daily average in the past three months.
TSMC dropped NT$1, or 1.5 percent, to NT$66. It plans to grant the stock options as a bonus, TSMC spokesman Tseng Jin-hao (曾晉皓) said in a phone interview.
TSMC on Tuesday hired Merrill Lynch & Co and Goldman Sachs Group Inc to help sell shares worth as much as US$1.14 billion that are currently held by Royal Philips Electronics NV.
"Taiwan Semiconductor's plans to grant stock options and sell shares overseas will create a massive influx of shares in the market," said Yu Reming, a fund manager at Prudential Securities Investment Trust Co (
Chi Mei Optoelectronics Corp (奇美電子) fell as much as 0.7 percent before closing unchanged at NT$45.10 after it sold US$573 million of shares overseas at a 4 percent discount to the stock's closing price on Tuesday.
Compeq Manufacturing Co (華通電子) fell NT$0.50, or 2.8 percent, to NT$17.60 after it said it is "reviewing" its loss forecast for this year after the Central News Agency reported it may widen its losses for the year. Compeq declined to comment on the report, saying the company had a NT$2.9 billion loss in the first nine months, compared with the NT$1.9 billion full-year net loss it projected for the year.
Taiwan Life Insurance Co (台灣人壽) gained NT$3, or 6.3 percent, to NT$51.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
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