Non-woven fabric maker Nan Liu Enterprise Co Ltd (南六企業) yesterday posted revenue of NT$1.61 billion (US$52.2 million) for the first quarter, a 2.3 percent year-on-year decline due to the slow season effect, but analysts said revenue could gain momentum later this year when its new plant in Kaohsiung’s Yanchao District (燕巢) begins operations.
Last quarter’s figure was also lower than the NT$1.69 billion forecast by Taishin Securities Investment Advisory Co (台新投顧), but revenue for the full year is forecast to increase by about 17 percent to NT$7.93 billion following an increase of 5.48 percent last year, Capital Investment Management Corp (群益投顧) said.
The company’s new plant in India is also expected to start contributing revenue next year after construction is completed this year, Capital Investment said.
The plant in Sanand, Gujarat state, is to be the company’s production base in South Asia and Nan Liu is planning to open two production lines of air-through non-woven fabric.
“Nan Liu’s growth momentum may persist due to its capacity expansion and its development of high value-added products,” Capital Investment said in a note.
Through vertical integration, Nan Liu has transformed from a maker of non-woven fabric for various global brands, including Japan’s UniCharm Co and US-based Procter & Gamble Co and Kimberly-Clark Corp, to a supplier of end-market products with high added value.
The company’s revenue breakdown by product for last year was 25 percent for air-through and thermal-bonded non-woven fabric, 23 percent for spunlace non-woven fabric, 40 percent for wet wipes and facial masks, and 12 percent for fabric for surgical gowns.
Nan Liu posted a net profit of NT$592.77 million for last year, up 9.49 percent from NT$541.38 million in 2017, or earnings per share of NT$8.16.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass