Tai Tong Food & Beverage Group (TTFB, 瓦城泰統集團), which operates six restaurant chains including Thai Town Cuisine (瓦城泰式料理), yesterday said it is to launch its seventh brand by the end of this year.
“The new brand featuring Southeast Asian flavors is in line with TTFB’s multiple-brand strategy,” chairman Charles Hsu (徐承義) told a news conference in Taichung, adding that the company plans to launch another five new cuisine chains before 2020.
TTFB plans to increase its domestic outlets from 104 to 125 by the end of the year, including increasing the number of Thai Town Cuisine branches from 60 to 65 and Very Thai Noodles from 21 to 28, Hsu said.
The restaurant operator also plans to add two or three outlets of Rice Bar (時時香), its sixth brand, which was launched in January, he said.
Given a saturated market in the nation’s major cities, the company is eyeing second and third-tier cities to avoid stiff competition, he said.
TTFB is also planning to increase the number of outlets in China from five to 11 by the end of this year and is hoping to expand its footprint in the US market within the next three years, he said.
“There are more than 6,000 Thai-style restaurants in [the US], but the majority of them are locally owned enterprises,” Hsu said, hinting at potential opportunities in this sector.
To help maintain food quality across its multiple restaurants, the company said it has secured land for its planned global innovation and logistics center in Taoyuan’s Jhongli District (中壢).
The facility, which is expected to cost more than NT$400 million (US$13.23 million) in total investment, is to start construction by the end of the year.
TTFB’s first-quarter net profit was NT$87.6 million, edging up 1.23 percent from the same period last year, with NT$3.77 in earnings per share, company data showed.
First-quarter gross margin was 52.83 percent, up from 51.45 percent a year ago, but operating margin slipped to 10.45 percent from 10.58 percent.
Revenue last month gained 8.51 percent year-on-year to NT$326.17 million, bringing total revenue in the first four months of the year to NT$1.37 billion, up 5.69 percent from a year earlier.
TTFB shares were unchanged at NT$249 in Taipei trading yesterday, beating the benchmark TAIEX, which edged down 0.44 percent to 9,969.45 points.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) secured a record 70.2 percent share of the global foundry business in the second quarter, up from 67.6 percent the previous quarter, and continued widening its lead over second-placed Samsung Electronics Co, TrendForce Corp (集邦科技) said on Monday. TSMC posted US$30.24 billion in sales in the April-to-June period, up 18.5 percent from the previous quarter, driven by major smartphone customers entering their ramp-up cycle and robust demand for artificial intelligence chips, laptops and PCs, which boosted wafer shipments and average selling prices, TrendForce said in a report. Samsung’s sales also grew in the second quarter, up
LIMITED IMPACT: Investor confidence was likely sustained by its relatively small exposure to the Chinese market, as only less advanced chips are made in Nanjing Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) saw its stock price close steady yesterday in a sign that the loss of the validated end user (VEU) status for its Nanjing, China, fab should have a mild impact on the world’s biggest contract chipmaker financially and technologically. Media reports about the waiver loss sent TSMC down 1.29 percent during the early trading session yesterday, but the stock soon regained strength and ended at NT$1,160, unchanged from Tuesday. Investors’ confidence in TSMC was likely built on its relatively small exposure to the Chinese market, as Chinese customers contributed about 9 percent to TSMC’s revenue last
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17