Textile manufacturer Lealea Enterprise Co (力麗) on Saturday said it would set up its first overseas factory in Indonesia this year.
Chairman James Kuo (郭紹儀) has made investing in Indonesia one of Lealea’s strategic priorities and set the goal of launching operations at the Indonesian site in the second half of the year, the company said.
Taipei-based Lealea, which makes polyester filament yarns and polyester chips, signed a memorandum of understanding with PT Taroko Indonesia and is to spend up to US$50 million to acquire PT Taroko’s production facilities in Bandung, Indonesia’s third-largest city.
PT Taroko is a joint venture between Taipei-based Taroko Textile Co (大魯閣纖維) and Nan Ya Plastics Corp (南亞塑膠), a Formosa Plastics Group (台塑集團) subsidiary.
Taroko Textile is selling the facility because it wants to diversify its interests beyond the textile sector and Nan Ya did not want to continue its investment.
Kuo sent several delegations to Bandung to evaluate the 50 hectare site and conduct an assessment on how to upgrade the facilities, the company said.
The Bandung plant will initially be involved in the fabric dying and finishing business before expanding to yarn making, Lealea said.
The company believes that demand for textile products in the Indonesian market is strong, and because textile exports from Indonesia to Japan and South Korea have duty-free status, the plant will export half of its production.
The Lealea Group (力麗集團), of which Lealea Enterprise is part, also plans to have another subsidiary, Li Peng Enterprise Co (力鵬), set up open warehousing facilities in the US later this year.
The facility will store the nylon chips and polyester chips that Lealea produces at its plants in Taiwan and Southeast Asia and will be able to accommodate about 2,000 tonnes of products.
Despite its overseas investment, the Lealea Group said it remains fully committed to its manufacturing operations in Taiwan to enhance its sustainable development.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass