Taiwan Land Development Corp (TLDC, 台灣土地開發) is seeking to transform its business model by expanding into the creative industry, as land development is likely to see another tough year, chairman Chiu Fu-sheng (邱復生) said yesterday.
“It is time to adopt a new business strategy to meet the needs of an ever-changing society,” said Chiu, whose company in June last year teamed up with Canada-based Cameron Thomson Group to build a studio park in Hualien County, with a view to making it a local version of Hollywood.
It secured a partnership with WPC Media Services five months later to set up a digital data bank to serve media and entertainment companies at more competitive costs.
Digitalization and innovation can work hand in hand with real-estate development in the pursuit of better living quality, Chiu said.
Toward the end, TLDC, which used to focus on the development of government-owned industrial parks, plan to introduce creative, digital and leisure elements to four existing development projects in Hsinchu, Hualien and Kinmen, he said.
Last week, TLDC celebrated the presence of sports brands Nike, New Balance, PUMA and Converse at Kinmen’s Wind Lion Plaza (風獅城), a build-operate-transfer project with the county government, Chiu said.
The move is TLDC’s latest bid to turn the plaza into a shopping haven for tourists from Taiwan, China and elsewhere using the “three small links” transport route, he said.
Retailers from China have voiced interest in setting up outlets in the plaza, attracted by its relatively low rent and duty-free business potential, Chiu said.
In addition, TLDC plans to boost the appeal of its Hsinpu Smart Park in Hsinchu by launching a peacock garden over the Lunar New Year holiday, he said.
The company owns a large plot of land in Hsinpu where the developer plans to build boutique hotels, service apartments and Hakka-style villas, flanked with a farm and tea garden on either side to provide the feeling of peace and harmony with the environment.
TLDC will also continue to develop Hualien Creative Park and a residential complex the Huilanwan Sunrise Village, Chiu said.
The former project includes a movie theater, a hotel, a cultural museum, a conference center and other facilities, while the latter offers “green,” “smart” apartments equipped with the latest technology devices and services.
“All TLDC projects mean to answer people’s longing to retire free and happy,” Chiu said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass