BlackBerry Ltd agreed to give Chinese manufacturer TCL Corp the right to use its brand on future phones and sell them around the world.
The deal, which was announced on Thursday without terms, gives investors and fans of the ailing smartphone brand a clearer picture of the future of the device that helped usher in the mobile age.
TCL has already built two phones for BlackBerry using off-the-shelf parts and blueprints: the touchscreen, Android-equipped DTEK50 and DTEK60.
BlackBerry chief executive officer John Chen (程守宗) has been weaning the company off phones since he took over the top job three years ago, replacing falling handset revenue with software acquisitions and saying in September he would outsource all device design, production and marketing.
This deal gives TCL exclusive rights to sell BlackBerrys everywhere except Indonesia, where BlackBerry has an existing licensing deal, and India, Bangladesh, Sri Lanka and Nepal.
Chen has said he is working on a deal with an Indian company, so the carve-out suggests such an agreement is still forthcoming.
A spokeswoman for BlackBerry did not immediately return a request for further details.
When Chen announced the outsourcing plan, he said the company could sign many licensing deals with manufacturers around the world, opening the possibility of dozens of BlackBerry-branded smartphones popping up in different countries.
The TCL agreement limits this to just a small handful of manufacturers, depending on what the final deal in India looks like.
BlackBerry has seen its share of the global smartphone market fall to a fraction of 1 percent, but its brand is still valued by some professionals in the US and Europe who miss the easy typing afforded by the company’s trademark keyboard.
Large groups of consumers in Indonesia and Nigeria still covet the brand’s high-class cachet.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass