Electric scooter manufacturer Gogoro Inc (睿能創意) yesterday said it expects sales to hit a new record-high of 1,000 Smartscooters this month.
That would represent a jump of 37.17 percent from sales of 729 units last month, securing Gogoro’s position as the nation’s top electric scooter maker.
Gogoro said that aside from breaking the company’s monthly record, the figure also represents a record-high for electric scooter sales in Taiwan.
“In less than six months, Gogoro sold about 3,000 Smartscooters, with accumulated mileage reaching 3 million kilometers in the nation,” Gogoro chief executive officer Horace Luke (陸學森) said in a statement.
Gogoro said that Smartscooter users in Taiwan travel an average of 124.1km per week, which is higher than the averate of 100km per week for all scooter riders, suggesting that Smartscooter owners use their electric scooters more often than other scooter owners.
To create a more convenient riding environment for users, Gogoro said the firm has partnered with Taipei Rapid Transit Corp (台北捷運公司) to build 21 battery-swapping stations near MRT stations.
“The density of GoStation battery-swapping stations in Greater Taipei has reached 1.3km. Riders do not need to worry about running out of power without a GoStation nearby,” the company said.
Gogoro added that it is extending a sales promotion plan to Jan. 31, in which buyers do not need to pay a deposit on Smartscooter purchases.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass