Win Semiconductors Corp (穩懋半導體) yesterday reported the highest revenue in the past 12 months for last month due to bullish demand from branded handset vendors ahead of new product launches this quarter and next quarter.
The Linkou (林口), Taoyuan County-based company said in a statement that revenue was NT$1.04 billion (US$34.5 million) last month on a consolidated basis, up 7.41 percent from the previous month, and also up 23.45 percent from a year earlier.
Win Semiconductors, the world’s largest pure-play gallium arsenide (GaAs) foundry, provides foundry services for GaAs components used in handsets, including smartphones. Its major clients — Singapore’s Avago Technologies Ltd, Japan’s Murata Manufacturing Co, China’s RDA Microelectronics Inc (銳迪科) and US-based Skyworks Solutions Inc — produce GaAs-based electronic devices used by Apple Inc, Samsung Electronics Co and Nokia Oyj in their products.
Last month, power amplifier (PA) chips accounted for more than 50 percent of its total sales, with others including Wi-Fi-linked components and infrastructure-related applications, such as those for base stations, optical fiber networks, satellite communications and national defense businesses.
Win Semiconductors’ latest sales data came after its local peers — Visual Photonics Epitaxy Co (全新光電) and Advanced Wireless Semiconductor Co (宏捷科技) — last week also reported strong sales for last month.
Last month, Visual Photonics, one of the top three GaAs epitaxial wafer manufacturers in the world, posted NT$218 million in consolidated sales, the highest level since July last year. The figure rose 5.3 percent from July and was 30.45 percent higher than in August last year.
In the same month, Advanced Wireless Semiconductor registered NT$275 million in consolidated sales, up 4.4 percent month-on-month and 221 percent year-on-year.
Win Semiconductors, Visual Photonics and Advanced Wireless Semiconductor have been dubbed among major “Apple concept stocks” in the local market and are expected to report strong sales this quarter, considering the launch of the iPhone 6 as well as demand for PA chips for non-Apple handsets and other Wi-Fi-linked components, analysts say.
In the first eight months of the year, Win Semiconductors reported cumulative sales of NT$6.13 billion, down 22.97 percent from a year earlier, with the declining pace slower than the 28.44 percent registered in the first seven months.
From January through last month, Visual Photonics’ cumulative sales were NT$1.33 billion, representing an annual fall of 16.1 percent, but also improving from the 21.65 percent decline seen in the first seven months, while Advanced Wireless Semiconductor’s sales during the same period increased 72.53 percent year-on-year to NT$1.33 billion.
However, Taiwan’s GaAs industry still faces potential challenges in the long term, such as price competition from complementary metal-oxide-semiconductor PA products, analysts say.
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would