Credit-card giant American Express (AmEx) on Tuesday announced a US$75.7 million settlement to resolve charges that it overbilled consumers and misled customers on services provided.
AmEx, a Dow component, is to pay US$16.2 million in fines and at least US$59.5 million in customer remediation, the company said.
The customer remediation is to go to more than 335,000 customers, the US Consumer Financial Protection Bureau (CFPB) said in a statement.
The action also involved the US Federal Deposit Insurance Corp (FDIC) and the US Office of the Comptroller of the Currency (OCC).
“We first warned companies last year about using deceptive marketing to sell credit card add-on products, and everyone should be on notice of this issue,” CFPB Director Richard Cordray said. “Consumers deserve to be treated fairly and should not pay for services they do not receive.”
The settlement resolves a variety of allegations over AmEx’s management of various supplementary products to customers, such as “identity protection.”
In some cases, AmEx charged consumers for identity protection services without the written authorization necessary to provide services, the CFPB said.
In other cases, consumers were misled about the benefits of an “account protector” program intended to offer relief after a major life event, such as unemployment or temporary disability.
AmEx said most of the costs associated with the settlements were already accounted for in previous quarters and that most of the remediation to customers has already been paid.
“American Express has cooperated fully with the CFPB, FDIC and OCC,” the company said in the statement, adding that it “continues to conduct internal reviews designed to identify issues, correct them and ensure that its products and practices meet a high standard of quality.”
Regulators had penalized the company last year for other violations related to credit-card add-on products in a deal that totaled US$112.5 million.
In that settlement, the firm was accused of deceiving customers who signed up for certain cards, leading them to believe they would receive benefits they did not.
American Express shares rose to a record US$88.69 on Tuesday.
The shares have climbed 54 percent this year, the second-best performance in the Dow Jones Industrial Average.
In October, AmEx announced its third-quarter profits rose 9.3 percent to US$1.37 billion.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome