Acer Inc (宏碁), the world’s fourth-largest PC maker by shipments, yesterday announced the appointment of Jason Chen (陳俊聖) as company president and CEO.
The company’s board, which approved the appointment yesterday, said Chen would be assigned an “important role of leading Acer through its corporate transformation.”
Chen, 52, is a senior vice president for worldwide sales and marketing at the world’s biggest contract chipmaker, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電).
“Jason is an excellent manager with extensive management experience and proven execution capability,” Acer chairman and interim CEO Stan Shih (施振榮) said in an e-mailed statement.
“We consider him to be the ideal executive to lead our transformation with his wealth of new thinking, international perspective, and willingness to face this challenge. Moreover, he shares the consensus on our strategy and development for Acer’s future,” Shih said.
After Chen takes office on Jan. 1, Shih will continue serving as company chairman and head of the newly established transformation committee, Acer said. Chen will also join the committee and work with Shih to review Acer’s new business strategies.
TSMC said in a filing to the Taiwan Stock Exchange yesterday that Chen had tendered his resignation and would leave next month.
The domestic unit of the Chinese-owned, Dutch-headquartered chipmaker Nexperia BV will soon be able to produce semiconductors locally within China, according to two company sources. Nexperia is at the center of a global tug-of-war over critical semiconductor technology, with a Dutch court in February ordering a probe into alleged mismanagement at the company. The geopolitical tussle has disrupted supply chains, with some carmakers reportedly forced to cut production due to chip shortages. Local production would allow Nexperia’s domestic arm, Nexperia Semiconductors (China) Ltd (安世半導體中國), to bypass restrictions in place since October on the supply of silicon wafers — etched with tiny components to
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Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday received government approval to deploy its advanced 3-nanometer (3nm) process at its second fab currently under construction in Japan, the Ministry of Economic Affairs said in a news release. The ministry green-lit the plan for the facility in Kumamoto, which is scheduled to start installing equipment and come online in 2028 with a monthly production capacity of 15,000 12-inch wafers, the ministry said. The Department of Investment Review in June 2024 authorized a US$5.26 billion investment for the facility, slated to manufacture 6- to 12nm chips, significantly less advanced than 3nm process. At a meeting with