The decline of the nation’s competitiveness ranking in the latest International Institute for Management Development (IMD) report shows the government needs to conduct a review to make improvements, Premier Jiang Yi-huah (江宜樺) said yesterday.
Jiang told a Cabinet meeting that there was no need to panic over the nation’s competitiveness because of the report, but Cabinet members have to take it as a “warning” and actively address the problems it has highlighted.
The IMD lowered Taiwan’s global competitiveness ranking for this year by four notches to 11th, the nation’s worst performance since 2009, with across-the-board declines in all four subindices — economic performance, government efficiency, business efficiency and infrastructure.
The IMD Competitiveness Index comprises four subindices, which are divided into 20 pillars made up of 323 variables.
Jiang demanded that Cabinet agencies review each variable with humility.
A set of economic stimulus measures that began last year went in the right direction, but the question was whether the government can fully implement the measures, he said.
At a press conference following the Cabinet meeting, Council for Economic Planning and Development Minister Kuan Chung-ming (管中閔) said that the report showed Taiwan’s global competitiveness ranking has declined, but that it did not mean Taiwan had become less competitive, rather that other countries had made more progress, Kuan said.
“Despite that, Taiwan’s competitiveness is still strong,” he said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It